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Co-authors
- Guangyuan LuState Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem andVerified email at mail.sim.ac.cn
- Tingke RaoPengcheng National LaboratoryVerified email at pcl.ac.cn
- Chaoliang TanThe University of Hong KongVerified email at hku.hk
- Wenzhong Bao (包文中)Fudan UniversityVerified email at fudan.edu.cn
- WANG HaominShanghai Institute of Microsystem and Information Technology, Chinese Academy of SciencesVerified email at mail.sim.ac.cn
- Fuyou Liao(廖付友)Postdoc, The Hong Kong Polytechnic UniversityVerified email at polyu.edu.hk
- Zhiyuan ShiShanghai Institute of Microsystem and Information Technology, CASVerified email at mail.sim.ac.cn
- Jun LouDepartment of Materials Science and NanoEngineering, Rice UniversityVerified email at rice.edu
- Ajayan PMProfessor of Materials Science and NanoEngineering, Rice UniversityVerified email at rice.edu
- Lingxiu ChenChina University of Mining and Technology (CUMT)Verified email at cumt.edu.cn
- Wanlin GuoProfessor of Mechanics, Nanjing Univeristy of Aeronautics and AstronauticsVerified email at nuaa.edu.cn
- Feng DingShenzhen Institute of Advanced Technology
- Haifeng Yang 杨海峰ShanghaiTech UniversityVerified email at shanghaitech.edu.cn