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Co-authors
- Jie ZhangBeijing University of Posts and TelecommunicationsVerified email at bupt.edu.cn
- Yongli ZhaoBeijing University of Posts and TelecommunicaitonsVerified email at bupt.edu.cn
- Ao Yu (于奥)Kuaishou Technology Co., Ltd., BeijingVerified email at kuaishou.com
- Young LeeSamsung ElectronicsVerified email at samsung.com
- Mohamed CherietFull Professor, ÉTS (U. of Quebec), Former Canada Research Chair, SYNCHROMEDIA Lab, CIRODDVerified email at etsmtl.ca
- Xiaosong YuBeijing University of Posts and TelecommunicationsVerified email at bupt.edu.cn
- Danshi WangBeijing University of Posts and TelecommunicationsVerified email at bupt.edu.cn
- Jason JueUniversity of Texas at DallasVerified email at utdallas.edu
- Li YajieBeijing University of Posts and TelecommunicationsVerified email at bupt.edu.cn
- Michel KadochProfessor of Electrical Engineering, Ecole de technologie superieureVerified email at etsmtl.ca
- Bijoy Chand ChatterjeeSouth Asian University, New Delhi, IndiaVerified email at sau.int
- Eiji OkiKyoto UniversityVerified email at i.kyoto-u.ac.jp
- Shanguo HuangBeijing University of Post and TelecommunicationVerified email at bupt.edu.cn
- Jiawei ZhangBeijing University of Posts and TelecommunicationsVerified email at bupt.edu.cn
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Hui Yang
Professor, IET Fellow, Beijing University of Posts and Telecommunications
Verified email at bupt.edu.cn - Homepage