| A review: On the development of low melting temperature Pb-free solders HR Kotadia, PD Howes, SH Mannan Microelectronics Reliability 54 (6-7), 1253-1273, 2014 | 457 | 2014 |
| A review of Laser Powder Bed Fusion Additive Manufacturing of aluminium alloys: Microstructure and properties HR Kotadia, G Gibbons, A Das, PD Howes Additive Manufacturing 46, 102155, 2021 | 275 | 2021 |
| Effect of high-intensity ultrasonic irradiation on the modification of solidification microstructure in a Si-rich hypoeutectic Al–Si alloy A Das, HR Kotadia Materials Chemistry and Physics 125 (3), 853-859, 2011 | 134 | 2011 |
| Intermetallic compound growth suppression at high temperature in SAC solders with Zn addition on Cu and Ni–P substrates HR Kotadia, O Mokhtari, MP Clode, MA Green, SH Mannan Journal of Alloys and Compounds 511 (1), 176-188, 2012 | 126 | 2012 |
| Modification of solidification microstructure in hypo-and hyper-eutectic Al–Si alloys under high-intensity ultrasonic irradiation HR Kotadia, A Das Journal of Alloys and Compounds 620, 1-4, 2015 | 70 | 2015 |
| On the microstructural refinement in commercial purity Al and Al-10 wt% Cu alloy under ultrasonication during solidification HR Kotadia, M Qian, DG Eskin, A Das Materials & Design 132, 266-274, 2017 | 64 | 2017 |
| Effect of Ni alloying on the microstructural evolution and mechanical properties of two duplex light-weight steels during different annealing temperatures: experiment and phase … A Rahnama, H Kotadia, S Sridhar Acta Materialia 132, 627-643, 2017 | 61 | 2017 |
| A comparative study of ternary Al–Sn–Cu immiscible alloys prepared by conventional casting and casting under high-intensity ultrasonic irradiation HR Kotadia, A Das, E Doernberg, R Schmid-Fetzer Materials Chemistry and Physics 131 (1-2), 241-249, 2011 | 59 | 2011 |
| Reactions of Sn-3.5 Ag-based solders containing Zn and Al additions on Cu and Ni (P) substrates HR Kotadia, O Mokhtari, M Bottrill, MP Clode, MA Green, SH Mannan Journal of electronic materials 39, 2720-2731, 2010 | 59 | 2010 |
| Solidification of Al-Sn-Cu based immiscible alloys under intense shearing HR Kotadia, E Doernberg, JB Patel, Z Fan, R Schmid-Fetzer Metallurgical and Materials Transactions A 40, 2202-2211, 2009 | 51 | 2009 |
| Novel approach to copper sintering using surface enhanced brass micro flakes for microelectronics packaging SK Bhogaraju, F Conti, HR Kotadia, S Keim, U Tetzlaff, G Elger Journal of Alloys and Compounds 844, 156043, 2020 | 36 | 2020 |
| Microstructural refinement of Al–10.2% Si alloy by intensive shearing HR Kotadia, NH Babu, H Zhang, Z Fan Materials Letters 64 (6), 671-673, 2010 | 35 | 2010 |
| Effects of Fe, Mn, chemical grain refinement and cooling rate on the evolution of Fe intermetallics in a model 6082 Al-alloy MH Khan, A Das, Z Li, HR Kotadia Intermetallics 132, 107132, 2021 | 31 | 2021 |
| Performance of dissimilar metal Self-Piercing Riveting (SPR) joint and coating behaviour under corrosive environment HR Kotadia, A Rahnama, IR Sohn, J Kim, S Sridhar Journal of Manufacturing Processes 39, 259-270, 2019 | 31 | 2019 |
| Joining TWIP to TWIP and TWIP to aluminium: A comparative study between joining processes, joint properties and mechanical performance I Papadimitriou, P Efthymiadis, HR Kotadia, IR Sohn, S Sridhar Journal of Manufacturing Processes 30, 195-207, 2017 | 29 | 2017 |
| Microstructural modification of recycled aluminium alloys by high-intensity ultrasonication: Observations from custom Al–2Si–2Mg–1.2 Fe–(0.5, 1.0) Mn alloys HR Kotadia, M Qian, A Das Journal of Alloys and Compounds 823, 153833, 2020 | 28 | 2020 |
| Effect of melt conditioning on heat treatment and mechanical properties of AZ31 alloy strips produced by twin roll casting S Das, NS Barekar, O El Fakir, L Wang, AKP Rao, JB Patel, HR Kotadia, ... Materials Science and Engineering: A 620, 223-232, 2015 | 28 | 2015 |
| Disabling of nanoparticle effects at increased temperature in nanocomposite solders O Mokhtari, A Roshanghias, R Ashayer, HR Kotadia, F Khomamizadeh, ... Journal of electronic materials 41, 1907-1914, 2012 | 28 | 2012 |
| Electromigration in Sn–Ag solder thin films under high current density X Zhu, H Kotadia, S Xu, H Lu, SH Mannan, C Bailey, YC Chan Thin Solid Films 565, 193-201, 2014 | 26 | 2014 |
| Additive manufacturing of aluminium alloy 2024 by laser powder bed fusion: microstructural evolution, defects and mechanical properties M Kumar, GJ Gibbons, A Das, I Manna, D Tanner, HR Kotadia Rapid Prototyping Journal 27 (7), 1388-1397, 2021 | 24 | 2021 |
Samjid H. MannanKing's College LondonVerified email at kcl.ac.uk
