| Recovery and improvement in low-velocity impact properties of e-glass/epoxy composites through novel self-healing technique S Zainuddin, T Arefin, A Fahim, MV Hosur, JD Tyson, A Kumar, J Trovillion, ... Composite Structures 108, 277-286, 2014 | 77 | 2014 |
| Mechanical characterization of doped SAC solder materials at high temperature MR Chowdhury, S Ahmed, A Fahim, JC Suhling, P Lall 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016 | 58 | 2016 |
| High temperature creep response of lead free solders A Fahim, S Ahmed, MMR Chowdhury, JC Suhling, P Lall Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2016 …, 2016 | 54 | 2016 |
| Optimization of mechanical and thermo-mechanical properties of epoxy and E-glass/epoxy composites using NH2-MWCNTs, acetone solvent and combined dispersion methods S Zainuddin, A Fahim, T Arifin, MV Hosur, MM Rahman, JD Tyson, ... Composite Structures 110, 39-50, 2014 | 44 | 2014 |
| Mechanical Characterization of Intermetallic Compounds in SAC Solder Joints at Elevated Temperatures A Fahim, S Ahmed, JC Suhling, P Lall 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2018 | 34 | 2018 |
| Evolution of the Mechanical Behavior of Lead Free Solders Exposed to Thermal Cycling SMK Hasan, A Fahim, JC Suhling, P Lall 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2019 | 31 | 2019 |
| Effect of different thermal cycling profiles on the mechanical behavior of SAC305 lead free solder M Al Ahsan, SMK Hasan, A Fahim, JC Suhling, P Lall 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020 | 26 | 2020 |
| Microstructural evolution in SAC305 and SAC-Bi solders subjected to mechanical cycling MMR Chowdhury, MA Hoque, A Fahim, JC Suhling, S Hamasha, P Lall International Electronic Packaging Technical Conference and Exhibition 51920 …, 2018 | 26 | 2018 |
| Nanomechanical characterization of IMCs formed in SAC solder joints subjected to isothermal aging A Fahim, S Ahmed, JC Suhling, P Lall Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2017 …, 2017 | 23 | 2017 |
| Nanoindentation measurements of the mechanical properties of individual phases within lead free solder joints subjected to isothermal aging A Fahim, S Ahmed, JC Suhling, P Lall International Electronic Packaging Technical Conference and Exhibition 51920 …, 2018 | 19 | 2018 |
| Investigation on the mechanical behavior evolution occurring in lead free solder joints exposed to thermal cycling A Fahim, SMK Hasan, JC Suhling, P Lall 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1486-1495, 2020 | 15 | 2020 |
| Nanoindentation testing of SAC305 solder joints subjected to thermal cycling loading A Fahim, SMK Hasan, JC Suhling, P Lall International Electronic Packaging Technical Conference and Exhibition 59322 …, 2019 | 14 | 2019 |
| Effects of Thermal Cycling on the Mechanical and Microstructural Evolution of SAC305 Lead-Free Solder SMK Hasan, A Fahim, JC Suhling, S Hamasha, P Lall International Electronic Packaging Technical Conference and Exhibition 59322 …, 2019 | 14 | 2019 |
| Mechanical behavior evolution of SAC305 lead free solder joints under thermal cycling A Fahim, K Hasan, S Ahmed, JC Suhling, P Lall 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2019 | 14 | 2019 |
| Creep behavior of various materials within PBGA packages subjected to thermal cycling loading A Fahim, K Hasan, JC Suhling, P Lall International Electronic Packaging Technical Conference and Exhibition 84041 …, 2020 | 13 | 2020 |
| Mechanical Behavior Evolution of SAC+ Bi Lead Free Solder Exposed to Thermal Cycling SMK Hasan, A Fahim, JC Suhling, P Lall 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020 | 13 | 2020 |
| Nanomechanical characterization of intermetallic compounds in lead free solder joints A Fahim, S Ahmed, JC Suhling, P Lall 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2359-2359, 2018 | 13 | 2018 |
| Modeling deformation behavior of multiple grained SAC305 solder joints D Mondal, A Fahim, JC Suhling, P Lall 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020 | 11 | 2020 |
| Morphological and mechanical behavior of chemically treated jute‐PHBV bio‐nanocomposites reinforced with silane grafted halloysite nanotubes S Zainuddin, A Fahim, S Shoieb, F Syed, MV Hosur, D Li, C Hicks, ... Journal of Applied Polymer Science 133 (39), 2016 | 11 | 2016 |
| Mechanical Property and Microstructure Evolution in SAC and Lead Free Solders Exposed to Various Thermal Cycling Profiles SMK Hasan, A Fahim, M Al Ahsan, JC Suhling, P Lall 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 868-876, 2021 | 10 | 2021 |
SM Kamrul HasanAuburn University, Tuskegee UniversityVerified email at tigermail.auburn.edu
