| Switching converter with pseudo-resonant DC link KDT Ngo US Patent 4,965,709, 1990 | 1310 | 1990 |
| A 1200-V, 60-A SiC MOSFET multichip phase-leg module for high-temperature, high-frequency applications Z Chen, Y Yao, D Boroyevich, KDT Ngo, P Mattavelli, K Rajashekara IEEE Transactions on Power Electronics 29 (5), 2307-2320, 2013 | 329 | 2013 |
| New core loss measurement method for high-frequency magnetic materials M Mu, Q Li, DJ Gilham, FC Lee, KDT Ngo IEEE Transactions on Power Electronics 29 (8), 4374-4381, 2013 | 279 | 2013 |
| Steady-state analysis and design of a switched-capacitor DC-DC converter KDT Ngo, R Webster 23rd Annual IEEE Power Electronics Specialists Conference, 1992., 378 - 385 …, 1992 | 227 | 1992 |
| Acoustic energy harvesting using an electromechanical Helmholtz resonator F Liu, A Phipps, S Horowitz, K Ngo, L Cattafesta, T Nishida, M Sheplak The Journal of the Acoustical Society of America 123 (4), 1983-1990, 2008 | 206 | 2008 |
| A PWM method for reduction of switching loss in a full-bridge inverter RS Lai, KDT Ngo IEEE Transactions on Power Electronics 10 (3), 326-332, 1995 | 201 | 1995 |
| Energy reclamation from a vibrating piezoceramic composite beam A Kasyap, J Lim, D Johnson, S Horowitz, T Nishida, K Ngo, M Sheplak, ... Proceedings of 9th International Congress on sound and vibration 9 (271), 36-43, 2002 | 180 | 2002 |
| Full-bridge lossless switching converter RL Steigerwald, KDT Ngo US Patent 4,864,479, 1989 | 157 | 1989 |
| A high-temperature sic three-phase ac-dc converter design for> 100/spl deg/c ambient temperature R Wang, D Boroyevich, P Ning, Z Wang, F Wang, P Mattavelli, KDT Ngo, ... IEEE Transactions on Power Electronics 28 (1), 555-572, 2012 | 146 | 2012 |
| Characterization of lead-free solder and sintered nano-silver die-attach layers using thermal impedance X Cao, T Wang, KDT Ngo, GQ Lu IEEE Transactions on Components, Packaging and Manufacturing Technology 1 (4 …, 2011 | 131 | 2011 |
| Survey of high-temperature polymeric encapsulants for power electronics packaging Y Yao, GQ Lu, D Boroyevich, KDT Ngo IEEE Transactions on Components, Packaging and Manufacturing Technology 5 (2 …, 2015 | 130 | 2015 |
| A novel high-temperature planar package for SiC multichip phase-leg power module P Ning, TG Lei, F Wang, GQ Lu, KDT Ngo, K Rajashekara IEEE Transactions on power Electronics 25 (8), 2059-2067, 2010 | 128 | 2010 |
| A novel active power decoupling single-phase PWM rectifier topology W Qi, H Wang, X Tan, G Wang, KDT Ngo 2014 IEEE Applied Power Electronics Conference and Exposition-APEC 2014, 89-95, 2014 | 127 | 2014 |
| SiC wirebond multichip phase-leg module packaging design and testing for harsh environment P Ning, R Lai, D Huff, F Wang, KDT Ngo, VD Immanuel, KJ Karimi IEEE Transactions on Power Electronics 25 (1), 16-23, 2009 | 117 | 2009 |
| Low noise, high frequency synchronous rectifier KDT Ngo, RL Steigerwald, JP Walden, BJ Baliga, CS Korman, HR Chang US Patent 4,903,189, 1990 | 110 | 1990 |
| A frequency-domain study on the effect of DC-link decoupling capacitors Z Chen, D Boroyevich, P Mattavelli, K Ngo 2013 IEEE Energy Conversion Congress and Exposition, 1886-1893, 2013 | 106 | 2013 |
| Behavioral modeling of the IGBT using the Hammerstein configuration JT Hsu, KDT Ngo IEEE transactions on Power Electronics 11 (6), 746-754, 1996 | 105 | 1996 |
| Ac vs. dc distribution for off-shore power delivery F Wang, Y Pei, D Boroyevich, R Burgos, K Ngo 2008 34th Annual Conference of IEEE Industrial Electronics, 2113-2118, 2008 | 101 | 2008 |
| Low frequency pulsed resonant converter for energy harvesting S Xu, KDT Ngo, T Nishida, GB Chung, A Sharma IEEE Transactions on power electronics 22 (1), 63-68, 2007 | 98 | 2007 |
| Balancing of peak currents between paralleled SiC MOSFETs by drive-source resistors and coupled power-source inductors Y Mao, Z Miao, CM Wang, KDT Ngo IEEE Transactions on Industrial Electronics 64 (10), 8334-8343, 2017 | 97 | 2017 |
