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Wilman Tsai
Wilman Tsai
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Year
Chloride Molecular Doping Technique on 2D Materials: WS2 and MoS2
L Yang, K Majumdar, H Liu, Y Du, H Wu, M Hatzistergos, PY Hung, ...
Nano letters 14 (11), 6275-6280, 2014
7522014
Forming a type I heterostructure in a group IV semiconductor
CO Chui, P Majhi, W Tsai, JT Kavalieros
US Patent 7,435,987, 2008
4622008
Germanium n-type shallow junction activation dependences
CO Chui, L Kulig, J Moran, W Tsai, KC Saraswat
Applied Physics Letters 87 (9), 2005
2412005
Metal-oxide-semiconductor capacitors on GaAs with high-k gate oxide and amorphous silicon interface passivation layer
S Koveshnikov, W Tsai, I Ok, JC Lee, V Torkanov, M Yakimov, ...
Applied physics letters 88 (2), 2006
2332006
Ultimate scaling of CMOS logic devices with Ge and III–V materials
M Heyns, W Tsai
Mrs bulletin 34 (7), 485-492, 2009
2322009
Characterization of ALCVD-Al2O3 and ZrO2 layer using X-ray photoelectron spectroscopy
H Nohira, W Tsai, W Besling, E Young, J Pétry, T Conard, W Vandervorst, ...
Journal of non-crystalline solids 303 (1), 83-87, 2002
2252002
High-performance self-aligned inversion-channel In0. 53Ga0. 47As metal-oxide-semiconductor field-effect-transistor with Al2O3∕ Ga2O3 (Gd2O3) as gate dielectrics
TD Lin, HC Chiu, P Chang, LT Tung, CP Chen, M Hong, J Kwo, W Tsai, ...
Applied Physics Letters 93 (3), 2008
1692008
Atomic layer deposition of hafnium oxide on germanium substrates
A Delabie, RL Puurunen, B Brijs, M Caymax, T Conard, B Onsia, ...
Journal of applied physics 97 (6), 2005
1342005
InGaAs metal-oxide-semiconductor capacitors with HfO2 gate dielectric grown by atomic-layer deposition
N Goel, P Majhi, CO Chui, W Tsai, D Choi, JS Harris
Applied physics letters 89 (16), 2006
1312006
High-k gate stack on GaAs and InGaAs using in situ passivation with amorphous silicon
S Oktyabrsky, V Tokranov, M Yakimov, R Moore, S Koveshnikov, W Tsai, ...
Materials Science and Engineering: B 135 (3), 272-276, 2006
982006
Band offsets of atomic-layer-deposited Al2O3 on GaAs and the effects of surface treatment
NV Nguyen, OA Kirillov, W Jiang, W Wang, JS Suehle, PD Ye, Y Xuan, ...
Applied Physics Letters 93 (8), 2008
902008
High-performance MoS2field-effect transistors enabled by chloride doping: Record low contact resistance (0.5 kΩ·µm) and record high drain current (460 µA/µm)
L Yang, K Majumdar, Y Du, H Liu, H Wu, M Hatzistergos, PY Hung, ...
2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical …, 2014
862014
The Fermi-level efficiency method and its applications on high interface trap density oxide-semiconductor interfaces
HC Lin, G Brammertz, K Martens, G De Valicourt, L Negre, WE Wang, ...
Applied physics letters 94 (15), 2009
842009
Subnanometer-equivalent-oxide-thickness germanium p-metal-oxide-semiconductor field effect transistors fabricated using molecular-beam-deposited high-k/metal gate stack
A Ritenour, A Khakifirooz, DA Antoniadis, RZ Lei, W Tsai, A Dimoulas, ...
Applied physics letters 88 (13), 2006
842006
In0. 53Ga0. 47As based metal oxide semiconductor capacitors with atomic layer deposition ZrO2 gate oxide demonstrating low gate leakage current and equivalent oxide thickness …
S Koveshnikov, N Goel, P Majhi, H Wen, MB Santos, S Oktyabrsky, ...
Applied Physics Letters 92 (22), 2008
832008
Self-aligned n-and p-channel GaAs MOSFETs on undoped and p-type substrates using HfO2 and silicon interface passivation layer
IJ Ok, H Kim, M Zhang, T Lee, F Zhu, L Yu, S Koveshnikov, W Tsai, ...
2006 International Electron Devices Meeting, 1-4, 2006
822006
Characteristics and mechanism of tunable work function gate electrodes using a bilayer metal structure on SiO/sub 2/and HfO/sub 2
CH Lu, GMT Wong, MD Deal, W Tsai, P Majhi, CO Chui, MR Visokay, ...
IEEE electron device letters 26 (7), 445-447, 2005
822005
Surface preparation and interfacial stability of high-k dielectrics deposited by atomic layer chemical vapor deposition
W Tsai, RJ Carter, H Nohira, M Caymax, T Conard, V Cosnier, S DeGendt, ...
Microelectronic Engineering 65 (3), 259-272, 2003
802003
Determination of interface energy band diagram between (100) Si and mixed Al–Hf oxides using internal electron photoemission
VV Afanas’ ev, A Stesmans, W Tsai
Applied physics letters 82 (2), 245-247, 2003
802003
Hot filament chemical vapor deposition reactor
D Garg, W Tsai, RL Iampietro, FM Kimock, CM Kelly
US Patent 5,160,544, 1992
801992
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