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Co-authors
- Zhangdui ZhongBeijing Jiaotong UniversityVerified email at bjtu.edu.cn
- Bo AiBeijing Jiaotong UniversityVerified email at ieee.org
- Octavia A. DobreTier-1 Canada Research Chair, IEEE Fellow, Memorial UniversityVerified email at mun.ca
- Soung Chang LiewThe Chinese University of Hong KongVerified email at ie.cuhk.edu.hk
- Xiaojun YuanUniversity of Electronic Science and Technology of ChinaVerified email at uestc.edu.cn
- Dongning Guo (郭东宁)Professor of Electrical and Computer Engineering, Northwestern UniversityVerified email at northwestern.edu
- Tony Q.S. QuekFull Professor and ISTD Pillar Head, SUTDVerified email at ieee.org
- zhao zhuyannokiaVerified email at vip.sina.com
- Jemin LeeAssociate Professor, Yonsei UniversityVerified email at yonsei.ac.kr
- Jue WangNantong UniversityVerified email at sutd.edu.sg
- Danijela Cabric, IEEE FellowUniversity of California, Los AngelesVerified email at ee.ucla.edu
- Wenbo WangBUPTVerified email at bupt.edu.cn
- Yonghui Lithe University of SydneyVerified email at sydney.edu.au
- Peng WangHuawei Technologies Sweden ABVerified email at huawei.com
- Branka VuceticThe University of SydneyVerified email at sydney.edu.au
- Chung ChanCity University of Hong KongVerified email at alum.mit.edu
- Moe Z. WinNASA Jet Propulsion Laboratory, AT&T Research Labs, Massachusetts Institute of Technology (MIT)Verified email at mit.edu
- Rongtao XuBeijing Jiaotong UniversityVerified email at bjtu.edu.cn
- Jiachun LiaoSchool of Electrical, Computer, and Energy Engineering, Arizona State UniversityVerified email at asu.edu
- Kazunori HayashiProfessor, Kyoto UniversityVerified email at i.kyoto-u.ac.jp
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Fanggang Wang
School of Electronic and Information Engineering, Beijing Jiaotong University
Verified email at bjtu.edu.cn