Pradeep Dixit
Pradeep Dixit
IIT Bombay India, NTU Singapore, VTT Finland
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Failure mechanisms and optimum design for electroplated copper through-silicon vias (TSV)
X Liu, Q Chen, P Dixit, R Chatterjee, RR Tummala, SK Sitaraman
2009 59th Electronic components and technology conference, 624-629, 2009
Aspect-ratio-dependent copper electrodeposition technique for very high aspect-ratio through-hole plating
P Dixit, J Miao
Journal of the Electrochemical society 153 (6), G552, 2006
Through-wafer electroplated copper interconnect with ultrafine grains and high density of nanotwins
L Xu, P Dixit, J Miao, JHL Pang, X Zhang, KN Tu, R Preisser
Applied physics letters 90 (3), 2007
Structure and migration of (112) step on (111) twin boundaries in nanocrystalline copper
L Xu, D Xu, KN Tu, Y Cai, N Wang, P Dixit, JHL Pang, J Miao
Journal of Applied Physics 104 (11), 2008
Fabrication of multiple through-holes in non-conductive materials by electrochemical discharge machining for RF MEMS packaging
J Arab, DK Mishra, HK Kannojia, P Adhale, P Dixit
Journal of Materials Processing Technology 271, 542-553, 2019
Effect of SF6 flow rate on the etched surface profile and bottom grass formation in deep reactive ion etching process
P Dixit, J Miao
Journal of Physics: Conference Series 34 (1), 577, 2006
Mechanical and microstructural characterization of high aspect ratio through-wafer electroplated copper interconnects
P Dixit, L Xu, J Miao, JHL Pang, R Preisser
Journal of Micromechanics and Microengineering 17 (9), 1749, 2007
Effect of tool electrode roughness on the geometric characteristics of through-holes formed by ECDM
J Arab, HK Kannojia, P Dixit
Precision Engineering 60, 437-447, 2019
Fabrication of high aspect ratio 35 μm pitch through-wafer copper interconnects by electroplating for 3-D wafer stacking
P Dixit, J Miao, R Preisser
Electrochemical and solid-state letters 9 (10), G305, 2006
High aspect ratio vertical through-vias for 3D MEMS packaging applications by optimized three-step deep RIE
P Dixit, J Miao
Journal of the Electrochemical Society 155 (2), H85, 2007
Fabrication and characterization of fine pitch on-chip copper interconnects for advanced wafer level packaging by a high aspect ratio through AZ9260 resist electroplating
P Dixit, CW Tan, L Xu, N Lin, J Miao, JHL Pang, P Backus, R Preisser
Journal of Micromechanics and Microengineering 17 (5), 1078, 2007
Fabrication and characterization of through-glass vias by the ECDM process
HK Kannojia, J Arab, BJ Pegu, P Dixit
Journal of the Electrochemical Society 166 (13), D531, 2019
Study of surface treatment processes for improvement in the wettability of silicon-based materials used in high aspect ratio through-via copper electroplating
P Dixit, X Chen, J Miao, S Divakaran, R Preisser
Applied surface science 253 (21), 8637-8646, 2007
Experimental investigations of energy channelization behavior in ultrasonic assisted electrochemical discharge machining
T Singh, A Dvivedi, A Shanu, P Dixit
Journal of Materials Processing Technology 293, 117084, 2021
Numerical and experimental investigation of thermomechanical deformation in high-aspect-ratio electroplated through-silicon vias
P Dixit, S Yaofeng, J Miao, JHL Pang, R Chatterjee, RR Tummala
Journal of The Electrochemical Society 155 (12), H981, 2008
Silicon nanopillars based 3D stacked microchannel heat sinks concept for enhanced heat dissipation applications in MEMS packaging
P Dixit, N Lin, J Miao, WK Wong, TK Choon
Sensors and Actuators A: Physical 141 (2), 685-694, 2008
Numerical and experimental investigations into microchannel formation in glass substrate using electrochemical discharge machining
DK Mishra, AK Verma, J Arab, D Marla, P Dixit
Journal of Micromechanics and Microengineering 29 (7), 075004, 2019
Influence of tool electrode feed rate in the electrochemical discharge drilling of a glass substrate
J Arab, P Dixit
Materials and Manufacturing Processes 35 (15), 1749-1760, 2020
High aspect ratio glass micromachining by multi-pass electrochemical discharge based micromilling technique
DK Mishra, J Arab, Y Magar, P Dixit
ECS Journal of Solid State Science and Technology 8 (6), P322, 2019
A review of intermetallic compound growth and void formation in electrodeposited Cu–Sn Layers for microsystems packaging
HK Kannojia, P Dixit
Journal of Materials Science: Materials in Electronics 32 (6), 6742-6777, 2021
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