Chipyard: Integrated design, simulation, and implementation framework for custom socs A Amid, D Biancolin, A Gonzalez, D Grubb, S Karandikar, H Liew, ... IEEE Micro 40 (4), 10-21, 2020 | 283 | 2020 |
Gemmini: Enabling systematic deep-learning architecture evaluation via full-stack integration H Genc, S Kim, A Amid, A Haj-Ali, V Iyer, P Prakash, J Zhao, D Grubb, ... 2021 58th ACM/IEEE Design Automation Conference (DAC), 769-774, 2021 | 233 | 2021 |
A highly energy-efficient hyperdimensional computing processor for biosignal classification A Menon, D Sun, S Sabouri, K Lee, M Aristio, H Liew, JM Rabaey IEEE Transactions on Biomedical Circuits and Systems 16 (4), 524-534, 2022 | 24 | 2022 |
Efficient emotion recognition using hyperdimensional computing with combinatorial channel encoding and cellular automata A Menon, A Natarajan, R Agashe, D Sun, M Aristio, H Liew, YS Shao, ... Brain informatics 9 (1), 14, 2022 | 22 | 2022 |
Hammer: a modular and reusable physical design flow tool H Liew, D Grubb, J Wright, C Schmidt, N Krzysztofowicz, A Izraelevitz, ... Proceedings of the 59th ACM/IEEE Design Automation Conference, 1335-1338, 2022 | 22 | 2022 |
Chipyard-An integrated SoC research and implementation environment A Amid, D Biancolin, A Gonzalez, D Grubb, S Karandikar, H Liew, ... 2020 57th ACM/IEEE Design Automation Conference (DAC), 1-6, 2020 | 8 | 2020 |
A scalable generator for massive MIMO baseband processing systems with beamspace channel estimation Y Dai, H Liew, ME Rasekh, SH Mirfarshbafan, A Gallyas-Sanhueza, ... 2021 IEEE Workshop on Signal Processing Systems (SiPS), 182-187, 2021 | 4 | 2021 |
A scalable massive MIMO uplink baseband processing generator Y Dai, G LaCaille, H Liew, J Dunn, B Nikolić ICC 2021-IEEE International Conference on Communications, 1-6, 2021 | 4 | 2021 |
FPGA with improved routability and robustness in 130nm CMOS with open-source CAD targetability G Yu, TY Cheng, B Kettlewell, H Liew, M Seok, PR Kinget arXiv preprint arXiv:1712.03411, 2017 | 4 | 2017 |
Yakun Sophia Shao, Krste Asanovic, and Borivoje Nikolic. 2020 A Amid, D Biancolin, A Gonzalez, D Grubb, S Karandikar, H Liew, ... Chipyard: Integrated design, simulation, and implementation framework for …, 2020 | 3 | 2020 |
Silicon Process Technology Constraints for Standardized Vertical Die-to-Die Interconnects H Liew, F Sheikh, D Kehlet, B Nikolić 2023 IEEE Custom Integrated Circuits Conference (CICC), 1-6, 2023 | 2 | 2023 |
An Adaptable and Scalable Generator of Distributed Massive MIMO Baseband Processing Systems Y Dai, ME Rasekh, SH Mirfarshbafan, H Liew, A Gallyas-Sanhueza, ... Journal of Signal Processing Systems 94 (10), 989-1003, 2022 | 2 | 2022 |
Phase-shift voltage regulation of dc-dc converters based on piezoelectric resonators M Touhami, H Liew, JD Boles 2024 IEEE Workshop on Control and Modeling for Power Electronics (COMPEL), 1-8, 2024 | 1 | 2024 |
HDBinaryCore: A 28nm 2048-bit Hyper-Dimensional biosignal classifier achieving 25 nJ/prediction for EMG hand-gesture recognition S Datta, B Richards, H Liew, Y Kim, D Sun, JM Rabaey ESSCIRC 2023-IEEE 49th European Solid State Circuits Conference (ESSCIRC …, 2023 | 1 | 2023 |
A Chisel Generator for Standardized 3D Die-to-Die Interconnects H Liew, F Sheikh, JR Guo, Z Wu, B Nikolić IEEE Journal on Exploratory Solid-State Computational Devices and Circuits, 2024 | | 2024 |
Towards Scalable Sub-THz Massive MIMO: Beamforming ASICs and 3D Die-to-Die Interconnects H Liew University of California, Berkeley, 2024 | | 2024 |
Accelerating Hyperdimensional Computing with Vector Machines A Menon, M Simbule, H Liew, A Tan, D Sun, JM Rabaey 2023 IEEE International Symposium on Circuits and Systems (ISCAS), 1-5, 2023 | | 2023 |