| A review of SiC power module packaging: Layout, material system and integration C Chen, F Luo, Y Kang CPSS Transactions on Power Electronics and Applications 2 (3), 170-186, 2017 | 293 | 2017 |
| Investigation, evaluation, and optimization of stray inductance in laminated busbar C Chen, X Pei, Y Chen, Y Kang IEEE Transactions on power electronics 29 (7), 3679-3693, 2013 | 163 | 2013 |
| Design and evaluation of laminated busbar for three-level T-type NPC power electronics building block with enhanced dynamic current sharing Z Yuan, H Peng, A Deshpande, B Narayanasamy, AI Emon, F Luo, ... IEEE Journal of Emerging and Selected Topics in Power Electronics 8 (1), 395-406, 2019 | 87 | 2019 |
| An SiC-based half-bridge module with an improved hybrid packaging method for high power density applications C Chen, Y Chen, Y Li, Z Huang, T Liu, Y Kang IEEE Transactions on Industrial Electronics 64 (11), 8980-8991, 2017 | 87 | 2017 |
| Design of a high-efficiency, high specific-power three-level T-type power electronics building block for aircraft electric-propulsion drives A Deshpande, Y Chen, B Narayanasamy, Z Yuan, C Chen, F Luo IEEE Journal of Emerging and Selected Topics in Power Electronics 8 (1), 407-416, 2019 | 77 | 2019 |
| Flexible PCB-based 3-D integrated SiC half-bridge power module with three-sided cooling using ultralow inductive hybrid packaging structure C Chen, Z Huang, L Chen, Y Tan, Y Kang, F Luo IEEE Transactions on Power Electronics 34 (6), 5579-5593, 2018 | 71 | 2018 |
| Reflected wave phenomenon in SiC motor drives: consequences, boundaries, and mitigation B Narayanasamy, AS Sathyanarayanan, F Luo, C Chen IEEE transactions on power electronics 35 (10), 10629-10642, 2020 | 53 | 2020 |
| High frequency conducted EMI investigation on packaging and modulation for a SiC-based high frequency converter Y Xie, C Chen, Z Huang, T Liu, Y Kang, F Luo IEEE Journal of Emerging and Selected Topics in Power Electronics 7 (3 …, 2019 | 51 | 2019 |
| Improved space vector modulation for neutral-point balancing control in hybrid-switch-based T-type neutral-point-clamped inverters with loss and common-mode voltage reduction H Peng, Z Yuan, X Zhao, B Narayanasamy, A Deshpande, AI Emon, ... CPSS Transactions on Power Electronics and Applications 4 (4), 328-338, 2019 | 46 | 2019 |
| A high-performance embedded SiC power module based on a DBC-stacked hybrid packaging structure Z Huang, C Chen, Y Xie, Y Yan, Y Kang, F Luo IEEE journal of emerging and selected topics in power electronics 8 (1), 351-366, 2019 | 42 | 2019 |
| On the practical design of a high power density SiC single-phase uninterrupted power supply system C Chen, Y Chen, Y Tan, J Fang, F Luo, Y Kang IEEE Transactions on Industrial Informatics 13 (5), 2704-2716, 2017 | 38 | 2017 |
| Investigation on Ultralow Turn-off Losses Phenomenon for SiC MOSFETs With Improved Switching Model Y Xie, C Chen, Y Yan, Z Huang, Y Kang IEEE Transactions on Power Electronics 36 (8), 9382-9397, 2021 | 36 | 2021 |
| A high efficiency model-based adaptive dead-time control method for GaN HEMTs considering nonlinear junction capacitors in triangular current mode operation Y Zhang, C Chen, T Liu, K Xu, Y Kang, H Peng IEEE Journal of Emerging and Selected Topics in Power Electronics 8 (1), 124-140, 2019 | 34 | 2019 |
| GaN-based megahertz single-phase inverter with a hybrid TCM control method for high efficiency and high-power density T Liu, C Chen, K Xu, Y Zhang, Y Kang IEEE Transactions on Power Electronics 36 (6), 6797-6813, 2020 | 32 | 2020 |
| A Dynamic Current Balancing Method for Paralleled SiC MOSFETs Using Monolithic Si-RC Snubber Based on a Dynamic Current Sharing Model J Lv, C Chen, B Liu, Y Yan, Y Kang IEEE Transactions on Power Electronics 37 (11), 13368-13384, 2022 | 30 | 2022 |
| The loss calculation of RCD snubber with forward and reverse recovery effects considerations C Cai, P Xue-jun, C Yu, K Yong 8th International Conference on Power Electronics-ECCE Asia, 3005-3012, 2011 | 30 | 2011 |
| A novel low inductive 3D SiC power module based on hybrid packaging and integration method Z Huang, Y Li, L Chen, Y Tan, C Chen, Y Kang, F Luo 2017 IEEE Energy Conversion Congress and Exposition (ECCE), 3995-4002, 2017 | 28 | 2017 |
| An analytical SiC MOSFET switching behavior model considering parasitic inductance and temperature effect Y Yan, Z Wang, C Chen, Y Kang, Z Yuan, F Luo 2020 IEEE Applied Power Electronics Conference and Exposition (APEC), 2829-2833, 2020 | 22 | 2020 |
| High strength and high ductility of Mg-10Gd-3Y alloy achieved by a novel extrusion-shearing process C Chen, D Han, M Wang, S Xu, T Cai, S Yang, F Shi, B Beausir, LS Toth Journal of Alloys and Compounds 931, 167498, 2023 | 21 | 2023 |
| A novel double-sided cooling inverter leg for high power density EV based on customized SiC power module X Liu, Z Wu, Y Yan, Y Kang, C Chen 2020 IEEE Energy Conversion Congress and Exposition (ECCE), 3151-3154, 2020 | 21 | 2020 |
