Sean King
Sean King
Sr. Technical Contributor
Verified email at intel.com
Title
Cited by
Cited by
Year
Cleaning of AlN and GaN surfaces
SW King, JP Barnak, MD Bremser, KM Tracy, C Ronning, RF Davis, ...
Journal of applied physics 84 (9), 5248-5260, 1998
3391998
Plasma enhanced atomic layer deposition of SiNx:H and SiO2
SW King
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 29 (4 …, 2011
1772011
Cleaning of GaN surfaces
LL Smith, SW King, RJ Nemanich, RF Davis
Journal of electronic materials 25 (5), 805-810, 1996
1681996
Transistor having an etch stop layer including a metal compound that is selectively formed over a metal gate
A Ott, S King, A Sharma
US Patent 8,120,114, 2012
1552012
UV photoemission study of heteroepitaxial AlGaN films grown on 6H-SiC
MC Benjamin, MD Bremser, TW Weeks Jr, SW King, RF Davis, ...
Applied Surface Science 104, 455-460, 1996
1481996
Adhesion and electromigration performance at an interface between a dielectric and metal
S King, J Klaus
US Patent 8,178,436, 2012
1382012
Dielectric barrier, etch stop, and metal capping materials for state of the art and beyond metal interconnects
SW King
ECS Journal of Solid State Science and Technology 4 (1), N3029, 2014
1332014
Negative electron affinity surfaces of aluminum nitride and diamond
RJ Nemanich, PK Baumann, MC Benjamin, ...
Diamond Relat. Mater 5 (6), 790-796, 1996
1231996
Fourier transform infrared spectroscopy investigation of chemical bonding in low-k a-SiC: H thin films
SW King, M French, J Bielefeld, WA Lanford
Journal of Non-Crystalline Solids 357 (15), 2970-2983, 2011
1002011
Dependence of (0001) GaN/AlN valence band discontinuity on growth temperature and surface reconstruction
SW King, C Ronning, RF Davis, MC Benjamin, RJ Nemanich
Journal of applied physics 84 (4), 2086-2090, 1998
891998
Research Updates: The three M's (materials, metrology, and modeling) together pave the path to future nanoelectronic technologies
SW King, H Simka, D Herr, H Akinaga, M Garner
APL Materials 1 (4), 040701, 2013
752013
Influence of network bond percolation on the thermal, mechanical, electrical and optical properties of high and low-k a-SiC: H thin films
SW King, J Bielefeld, G Xu, WA Lanford, Y Matsuda, RH Dauskardt, N Kim, ...
Journal of Non-Crystalline Solids 379, 67-79, 2013
722013
Investigation of the impact of insulator material on the performance of dissimilar electrode metal-insulator-metal diodes
N Alimardani, SW King, BL French, C Tan, BP Lampert, JF Conley Jr
Journal of Applied Physics 116 (2), 024508, 2014
692014
Intrinsic stress effect on fracture toughness of plasma enhanced chemical vapor deposited SiN x: H films
S King, R Chu, G Xu, J Huening
Thin Solid Films 518 (17), 4898-4907, 2010
662010
Wet Chemical Processing of (0001) Si 6H‐SiC Hydrophobic and Hydrophilic Surfaces
SW King, RJ Nemanich, RF Davisa
Journal of the Electrochemical Society 146 (5), 1910-1917, 1999
661999
Film property requirements for hermetic low-k a-SiOxCyNz: H dielectric barriers
SW King, D Jacob, D Vanleuven, B Colvin, J Kelly, M French, J Bielefeld, ...
ECS Journal of Solid State Science and Technology 1 (6), N115, 2012
652012
Mass and bond density measurements for PECVD a-SiC x: H thin films using Fourier transform-infrared spectroscopy
SW King, J Bielefeld, M French, WA Lanford
Journal of Non-Crystalline Solids 357 (21), 3602-3615, 2011
592011
X-ray photoelectron spectroscopy measurement of the Schottky barrier at the SiC (N)/Cu interface
SW King, M French, M Jaehnig, M Kuhn, B Boyanov, B French
Journal of Vacuum Science & Technology B, Nanotechnology and …, 2011
592011
Nanoscale mapping of contact stiffness and damping by contact resonance atomic force microscopy
G Stan, SW King, RF Cook
Nanotechnology 23 (21), 215703, 2012
582012
Intrinsic stress fracture energy measurements for PECVD thin films in the SiOxCyNz: H system
SW King, JA Gradner
Microelectronics Reliability 49 (7), 721-726, 2009
572009
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