| Cleaning of AlN and GaN surfaces SW King, JP Barnak, MD Bremser, KM Tracy, C Ronning, RF Davis, ... Journal of applied physics 84 (9), 5248-5260, 1998 | 339 | 1998 |
| Plasma enhanced atomic layer deposition of SiNx:H and SiO2 SW King Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 29 (4 …, 2011 | 177 | 2011 |
| Cleaning of GaN surfaces LL Smith, SW King, RJ Nemanich, RF Davis Journal of electronic materials 25 (5), 805-810, 1996 | 168 | 1996 |
| Transistor having an etch stop layer including a metal compound that is selectively formed over a metal gate A Ott, S King, A Sharma US Patent 8,120,114, 2012 | 155 | 2012 |
| UV photoemission study of heteroepitaxial AlGaN films grown on 6H-SiC MC Benjamin, MD Bremser, TW Weeks Jr, SW King, RF Davis, ... Applied Surface Science 104, 455-460, 1996 | 148 | 1996 |
| Adhesion and electromigration performance at an interface between a dielectric and metal S King, J Klaus US Patent 8,178,436, 2012 | 138 | 2012 |
| Dielectric barrier, etch stop, and metal capping materials for state of the art and beyond metal interconnects SW King ECS Journal of Solid State Science and Technology 4 (1), N3029, 2014 | 133 | 2014 |
| Negative electron affinity surfaces of aluminum nitride and diamond RJ Nemanich, PK Baumann, MC Benjamin, ... Diamond Relat. Mater 5 (6), 790-796, 1996 | 123 | 1996 |
| Fourier transform infrared spectroscopy investigation of chemical bonding in low-k a-SiC: H thin films SW King, M French, J Bielefeld, WA Lanford Journal of Non-Crystalline Solids 357 (15), 2970-2983, 2011 | 100 | 2011 |
| Dependence of (0001) GaN/AlN valence band discontinuity on growth temperature and surface reconstruction SW King, C Ronning, RF Davis, MC Benjamin, RJ Nemanich Journal of applied physics 84 (4), 2086-2090, 1998 | 89 | 1998 |
| Research Updates: The three M's (materials, metrology, and modeling) together pave the path to future nanoelectronic technologies SW King, H Simka, D Herr, H Akinaga, M Garner APL Materials 1 (4), 040701, 2013 | 75 | 2013 |
| Influence of network bond percolation on the thermal, mechanical, electrical and optical properties of high and low-k a-SiC: H thin films SW King, J Bielefeld, G Xu, WA Lanford, Y Matsuda, RH Dauskardt, N Kim, ... Journal of Non-Crystalline Solids 379, 67-79, 2013 | 72 | 2013 |
| Investigation of the impact of insulator material on the performance of dissimilar electrode metal-insulator-metal diodes N Alimardani, SW King, BL French, C Tan, BP Lampert, JF Conley Jr Journal of Applied Physics 116 (2), 024508, 2014 | 69 | 2014 |
| Intrinsic stress effect on fracture toughness of plasma enhanced chemical vapor deposited SiN x: H films S King, R Chu, G Xu, J Huening Thin Solid Films 518 (17), 4898-4907, 2010 | 66 | 2010 |
| Wet Chemical Processing of (0001) Si 6H‐SiC Hydrophobic and Hydrophilic Surfaces SW King, RJ Nemanich, RF Davisa Journal of the Electrochemical Society 146 (5), 1910-1917, 1999 | 66 | 1999 |
| Film property requirements for hermetic low-k a-SiOxCyNz: H dielectric barriers SW King, D Jacob, D Vanleuven, B Colvin, J Kelly, M French, J Bielefeld, ... ECS Journal of Solid State Science and Technology 1 (6), N115, 2012 | 65 | 2012 |
| Mass and bond density measurements for PECVD a-SiC x: H thin films using Fourier transform-infrared spectroscopy SW King, J Bielefeld, M French, WA Lanford Journal of Non-Crystalline Solids 357 (21), 3602-3615, 2011 | 59 | 2011 |
| X-ray photoelectron spectroscopy measurement of the Schottky barrier at the SiC (N)/Cu interface SW King, M French, M Jaehnig, M Kuhn, B Boyanov, B French Journal of Vacuum Science & Technology B, Nanotechnology and …, 2011 | 59 | 2011 |
| Nanoscale mapping of contact stiffness and damping by contact resonance atomic force microscopy G Stan, SW King, RF Cook Nanotechnology 23 (21), 215703, 2012 | 58 | 2012 |
| Intrinsic stress fracture energy measurements for PECVD thin films in the SiOxCyNz: H system SW King, JA Gradner Microelectronics Reliability 49 (7), 721-726, 2009 | 57 | 2009 |
Robert J. NemanichDepartment of Physics, Arizona State UniversityVerified email at asu.edu
