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Alan Hynes
Alan Hynes
CCAN, Tyndall National Institute, University College Cork
Verified email at ccan.ie - Homepage
Title
Cited by
Cited by
Year
Pulsed plasma polymerization of maleic anhydride
ME Ryan, AM Hynes, JPS Badyal
Chemistry of materials 8 (1), 37-42, 1996
2571996
Recent advances in silicon etching for MEMS using the ASE™ process
AM Hynes, H Ashraf, JK Bhardwaj, J Hopkins, I Johnston, JN Shepherd
Sensors and Actuators A: Physical 74 (1-3), 13-17, 1999
2531999
Method of surface treatment of semiconductor substrates
JK Bhardwaj, H Ashraf, B Khamsehpour, J Hopkins, AM Hynes, ME Ryan, ...
US Patent 6,051,503, 2000
2402000
Method and apparatus for etching a substrate
J Hopkins, IR Johnston, JK Bhardwaj, H Ashraf, AM Hynes, LM Lea
US Patent 6,187,685, 2001
1552001
Pulsed plasma polymerization of perfluorocyclohexane
AM Hynes, MJ Shenton, JPS Badyal
Macromolecules 29 (12), 4220-4225, 1996
941996
A methodology for curve‐fitting of the XPS Si 2p core level from thin siloxane coatings
LA O'Hare, A Hynes, MR Alexander
Surface and Interface Analysis: An International Journal devoted to the …, 2007
892007
Gallium and indium compounds of sulphur donor ligands: Pyridine-2-thiolates and diphenylthiophosphinates
CC Landry, A Hynes, AR Barron, I Haiduc, C Silvestru
Polyhedron 15 (3), 391-402, 1996
601996
Method of surface treatment of semiconductor substrates
JK Bhardwaj, H Ashraf, B Khamsehpour, J Hopkins, AM Hynes, ME Ryan, ...
US Patent 6,261,962, 2001
592001
Effect of plasma exposure on the chemistry and morphology of aerosol‐assisted, plasma‐deposited coatings
B Twomey, M Rahman, G Byrne, A Hynes, LA O'Hare, L O'Neill, ...
Plasma processes and polymers 5 (8), 737-744, 2008
562008
The benefits of process parameter ramping during the plasma etching of high aspect ratio silicon structures
J Hopkins, H Ashraf, JK Bhardwaj, AM Hynes, I Johnston, JN Shepherd
MRS Online Proceedings Library (OPL) 546, 63, 1998
461998
Atmospheric pressure plasma treatment of amorphous polyethylene terephthalate for enhanced heatsealing properties
DP Dowling, J Tynan, P Ward, AM Hynes, J Cullen, G Byrne
International Journal of Adhesion and Adhesives 35, 1-8, 2012
442012
Selective incorporation of perfluorinated phenyl rings during pulsed plasma polymerization of perfluoroallylbenzene
A Hynes, JPS Badyal
Chemistry of materials 10 (8), 2177-2182, 1998
341998
Comparison of pilot and industrial scale atmospheric pressure glow discharge systems including a novel electro-acoustic technique for process monitoring
J Tynan, VJ Law, P Ward, AM Hynes, J Cullen, G Byrne, S Daniels, ...
Plasma Sources Science and Technology 19 (1), 015015, 2009
322009
Plasma polymerization of 2-iodothiophene
ME Ryan, AM Hynes, SH Wheale, JPS Badyal, C Hardacre, RM Ormerod
Chemistry of materials 8 (4), 916-921, 1996
321996
Plasma polymerization of trifluoromethyl-substituted perfluorocyclohexane monomers
AM Hynes, MJ Shenton, JPS Badyal
Macromolecules 29 (1), 18-21, 1996
251996
Rapid discharge sintering of nickel–diamond metal matrix composites
B Twomey, A Breen, G Byrne, A Hynes, DP Dowling
Journal of Materials Processing Technology 211 (7), 1210-1216, 2011
222011
Defining conditions for the etching of silicon in an inductive coupled plasma reactor
H Ashraf, JK Bhardwaj, E Guibarra, S Hall, J Hopkins, AM Hynes, ...
MRS Online Proceedings Library (OPL) 605, 299, 1999
141999
Advances in high rate silicon and oxide etching using ICP
J Bhardwaj, H Ashraf, J Hopkins, I Johnston, S McAuley, S Hall, ...
MEMS/MST technology symposium at SEMICON West 99, 1999
131999
Evaluation of the mechanical behaviour of nanometre-thick coatings deposited using an atmospheric pressure plasma system
B Twomey, G Byrne, A Hynes, L O'Neill, D Dowling
Surface and Coatings Technology 203 (14), 2021-2029, 2009
122009
Fluid Replacement System
J Kennedy, R Sibbick, F Swallow, P Dobbyn, A Hynes, J Brennan
US Patent App. 12/299,133, 2009
112009
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