| Evolution of the Mechanical Behavior of Lead Free Solders Exposed to Thermal Cycling SMK Hasan, A Fahim, JC Suhling, P Lall 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2019 | 31 | 2019 |
| Effect of different thermal cycling profiles on the mechanical behavior of SAC305 lead free solder M Al Ahsan, SMK Hasan, A Fahim, JC Suhling, P Lall 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020 | 26 | 2020 |
| A study of poly (3-hydroxybutyrate-co-3-hydroxyvalerate) biofilms’ thermal and biodegradable properties reinforced with halloysite nanotubes SMK Hasan, S Zainuddin, J Tanthongsack, MV Hosur, L Allen Journal of Composite Materials 52 (23), 3199-3207, 2018 | 20 | 2018 |
| Investigation on the mechanical behavior evolution occurring in lead free solder joints exposed to thermal cycling A Fahim, SMK Hasan, JC Suhling, P Lall 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1486-1495, 2020 | 15 | 2020 |
| Effects of Thermal Cycling on the Mechanical and Microstructural Evolution of SAC305 Lead-Free Solder SMK Hasan, A Fahim, JC Suhling, S Hamasha, P Lall International Electronic Packaging Technical Conference and Exhibition 59322 …, 2019 | 14 | 2019 |
| Nanoindentation testing of SAC305 solder joints subjected to thermal cycling loading A Fahim, SMK Hasan, JC Suhling, P Lall International Electronic Packaging Technical Conference and Exhibition 59322 …, 2019 | 14 | 2019 |
| Mechanical behavior evolution of SAC305 lead free solder joints under thermal cycling A Fahim, K Hasan, S Ahmed, JC Suhling, P Lall 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2019 | 14 | 2019 |
| Creep behavior of various materials within PBGA packages subjected to thermal cycling loading A Fahim, K Hasan, JC Suhling, P Lall International Electronic Packaging Technical Conference and Exhibition 84041 …, 2020 | 13 | 2020 |
| Mechanical Behavior Evolution of SAC+ Bi Lead Free Solder Exposed to Thermal Cycling SMK Hasan, A Fahim, JC Suhling, P Lall 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020 | 13 | 2020 |
| Mechanical, fire retardant, water absorption and soil biodegradation properties of poly (3-hydroxy-butyrate-co-3-valerate) nanofilms S Zainuddin, SM Kamrul Hasan, D Loeven, M Hosur Journal of Polymers and the Environment 27, 2292-2304, 2019 | 11 | 2019 |
| Mechanical Property and Microstructure Evolution in SAC and Lead Free Solders Exposed to Various Thermal Cycling Profiles SMK Hasan, A Fahim, M Al Ahsan, JC Suhling, P Lall 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 868-876, 2021 | 10 | 2021 |
| Mechanical property evolution in SAC+ Bi lead free solders subjected to various thermal exposures M Al Ahsan, SMK Hasan, A Fahim, JC Suhling, P Lall 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2021 | 9 | 2021 |
| Evaluation of the creep response of lead free solder materials subjected to thermal cycling SMK Hasan, A Fahim, JC Suhling, P Lall International Electronic Packaging Technical Conference and Exhibition 84041 …, 2020 | 9 | 2020 |
| Nanomechanical Characterization of Various Materials within PBGA Packages Subjected to Thermal Cycling Loading A Fahim, K Hasan, JC Suhling, P Lall 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020 | 9 | 2020 |
| Quasi-static compression characterization of binary nanoclay/graphene reinforced carbon/epoxy composites subjected to seawater conditioning M Al Ahsan, M Hosur, SH Tareq, SMK Hasan Materials Research Express 7 (1), 015033, 2020 | 8 | 2020 |
| Creep and Microstructure Evolutions in SAC305 Lead Free Solder Subjected to Different Thermal Exposure Profiles SMK Hasan, M Al Ahsan, JC Suhling, P Lall 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2191-2200, 2022 | 6 | 2022 |
| The Effect of Bismuth Content on Mechanical Property Evolution of SAC+ Bi Lead Free Solders Subjected to Long Term Thermal Exposures M Al Ahsan, SMK Hasan, JC Suhling, P Lall 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical …, 2022 | 5 | 2022 |
| Mechanical Property Evolution in SAC+ Bi Lead-Free Solders Subjected to Various Thermal Exposure Profiles M Al Ahsan, SMK Hasan, MA Haq, JC Suhling, P Lall 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1637-1645, 2022 | 5 | 2022 |
| Comparison of thermal cycling induced mechanical property evolutions in bulk solder and solder joints SMK Hasan, A Fahim, M Al Ahsan, JC Suhling, P Lall 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2021 | 4 | 2021 |
| Evolution of Mechanical Properties and Microstructure in SAC Bulk Solder and Solder Joints During Thermal Cycling Exposures SMK Hasan, A Fahim, M Al Ahsan, JC Suhling, S Hamasha, P Lall International Electronic Packaging Technical Conference and Exhibition 85505 …, 2021 | 2 | 2021 |
Jeffrey C. SuhlingAuburn University, Department of Mechanical EngineeringVerified email at auburn.edu
