| Effect of alloying additions on the SFE, Neel temperature and shape memory effect in Fe-Mn-Si-based alloys NE Stanford, K Chen, DP Dunne, XJ Jin ISIJ international 47 (6), 883-889, 2007 | 32 | 2007 |
| From micro-to nano-scale molding of metals: Size effect during molding of single crystal Al with rectangular strip punches K Chen, WJ Meng, F Mei, J Hiller, DJ Miller Acta Materialia 59 (3), 1112-1120, 2011 | 28 | 2011 |
| Fabrication, assembly and heat transfer testing of low-profile copper-based microchannel heat exchangers B Lu, K Chen, WJ Meng, F Mei Journal of Micromechanics and Microengineering 20 (11), 115002, 2010 | 26 | 2010 |
| Thickness dependence of flow stress of Cu thin films in confined shear plastic flow Y Mu, K Chen, WJ Meng MRS Communications 4 (03), 129-133, 2014 | 17 | 2014 |
| A new experimental approach for evaluating the mechanical integrity of interfaces between hard coatings and substrates K Chen, Y Mu, WJ Meng MRS Communications 4 (01), 19-23, 2014 | 12 | 2014 |
| Low temperature deposited titanium boride thin films and their application to surface engineering of microscale mold inserts Y Mu, K Chen, WJ Meng, F Mei Microsystem technologies 18 (5), 667-677, 2012 | 11 | 2012 |
| Interface Development in Cu-Based Structures Transient Liquid Phase (TLP) Bonded with Thin Al Foil Intermediate Layers K Chen, WJ Meng, JA Eastman Metallurgical and Materials Transactions A 45 (9), 3892-3906, 2014 | 10 | 2014 |
| Size dependence of the plane-strain response of single-crystal Al to indentation by diamond wedges K Chen, WJ Meng, GB Sinclair Acta Materialia 60 (12), 4879-4887, 2012 | 9 | 2012 |
| Transient liquid phase bonding of Cu-based microchannel devices K Chen, F Mei, WJ Meng Proceedings of 5th International Conference on Micro-Manufacturing, Madison …, 2010 | 8 | 2010 |
| Scaling the response of microscale compression molding of elemental Cu in the presence of dynamic recrystallization F Mei, K Chen, J Jiang, WJ Meng Acta Materialia 58 (7), 2638-2645, 2010 | 7 | 2010 |
| Quantification of thermal resistance of transient-liquid-phase bonded Cu/Al/Cu interfaces for assembly of Cu-based microchannel heat exchangers B Lu, K Chen, WJ Meng, A Karki, R Jin Journal of Micro and Nano-Manufacturing 1 (3), 031001, 2013 | 6 | 2013 |
| Manufacturing of metal-based microparts: Fabrication strategies and surface engineering applications Y Mu, K Chen, B Lu, WJ Meng, GL Doll Surface and Coatings Technology 237, 390-401, 2013 | 5 | 2013 |
| Bonding of Cu-based high aspect ratio microscale structures with Sn intermediate layers F Mei, K Chen, B Lu, WJ Meng Microsystem technologies 15 (7), 1111-1118, 2009 | 5 | 2009 |
| Threaded connections and downhole tools incorporating the same Xiaoge Gan, Ke Chen,Venkatesh Karuppiah,Anthony L. Collins,Ke Ken Li,Fei ... US Patent US20190078398A1, 2019 | | 2019 |
| Cutting structure of cutting elements for downhole cutting Huimin SONG, Xiaoge Gan, Zhijun LIN,Ke Chen US Patent US20180274303A1, 2018 | | 2018 |
| Scoop shaped diamond table on non-planar cutting elements Huimin SONG,Xiaoge Gan,Zhijun Lin, Ke Chen WO Patent WO2017095714A1, 2017 | | 2017 |
| Micro & Nano Scale Mechanical Testing and Assembly with Applications to Metal Based Microsystems K Chen Louisiana State University, 2013 | | 2013 |
| Fe‐Mn‐Si ベース合金における添加合金の SFE, Neel 温度, および形状記憶効果への効果 NE STANFORD, K CHEN, DP DUNNE, XJ JIN ISIJ Int (Iron Steel Inst Jpn) 47 (6), 883-889, 2007 | | 2007 |
