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- Jr-Hau He 何志浩Professor of Materials Science & Engineering, City University of Hong KongVerified email at cityu.edu.hk
- Lain-Jong LiUniversity of Hong KongVerified email at hku.hk
- Dung-Sheng TsaiUC BerkeleyVerified email at berkeley.edu
- Der-Hsien LienNational Chiao Tung UniversityVerified email at nctu.edu.tw
- lj Chen新竹清華大學材料科學工程教授Verified email at mx.nthu.edu.tw
- Qi DingUniversity of Wisconsin-MadisonVerified email at chem.wisc.edu
- Chin-An LinNational Taiwan UniversityVerified email at ntu.edu.tw
- Chang-Hsiao ChenDepartment of Electrical Engineering, National Sun Yat-sen UniversityVerified email at mail.ee.nsysu.edu.tw
- Chih-I WuPrinceton University and National Taiwan University and Industrial Technology Research InstituteVerified email at ntu.edu.tw
- Song JinUniversity of Wisconsin-MadisonVerified email at chem.wisc.edu
- Kazu SuenagaOsaka UniversityVerified email at sanken.osaka-u.ac.jp
- Yung-Chang LinAISTVerified email at aist.go.jp
- Tzu Chiao WeiNational Taiwan UniversityVerified email at g.ntu.edu.tw
- Yu-Lun ChuehNational Tsing Huniversity, Materials Science and EngineeringVerified email at mx.nthu.edu.tw
- Susan, Sheng-Han SuUniversität Stuttgart, Max-Planck SocietyVerified email at imw.uni-stuttgart.de
- José Ramón Durán RetamalICN2: Catalan Institute of Nanoscience and NanotechnologyVerified email at icn2.cat
- Shu Ping LauThe Hong Kong Polytechnic University and Nanyang Technological UniversityVerified email at polyu.edu.hk
- Hsin-Ping WangStanford UniversityVerified email at stanford.edu
- Chun-Ho LinARC DECRA Fellow, University of New South WalesVerified email at unsw.edu.au
- Jan-Kai ChangCenter for Bio-Integrated Electronics, Northwestern UniversityVerified email at northwestern.edu