| Electric current effects upon the Sn/Cu and Sn/Ni interfacial reactions SW Chen, CM Chen, WC Liu Journal of electronic materials 27 (11), 1193-1199, 1998 | 246 | 1998 |
| Electromigration effect upon the Sn/Ag and Sn/Ni interfacial reactions at various temperatures CM Chen, SW Chen Acta materialia 50 (9), 2461-2469, 2002 | 157 | 2002 |
| Electric current effects on Sn/Ag interfacial reactions CM Chen, SW Chen Journal of electronic materials 28 (7), 902-906, 1999 | 145 | 1999 |
| Immobilization of Poly(N-vinyl-2-pyrrolidone)-Capped Platinum Nanoclusters on Indium−Tin Oxide Glass and Its Application in Dye-Sensitized Solar Cells TC Wei, CC Wan, YY Wang, C Chen, H Shiu The Journal of Physical Chemistry C 111 (12), 4847-4853, 2007 | 131 | 2007 |
| Electromigration effect upon the Sn–0.7 wt% Cu/Ni and Sn–3.5 wt% Ag/Ni interfacial reactions C Chen, S Chen Journal of Applied Physics 90 (3), 1208-1214, 2001 | 109 | 2001 |
| Chemical deposition of platinum on metallic sheets as counterelectrodes for dye-sensitized solar cells CM Chen, CH Chen, TC Wei Electrochimica Acta 55 (5), 1687-1695, 2010 | 93 | 2010 |
| Electromigration study in the eutectic SnBi solder joint on the Ni/Au metallization L Chen, C Chen Journal of materials research 21 (4), 962-969, 2006 | 87 | 2006 |
| Improvement of thermal management of high-power GaN-based light-emitting diodes BH Liou, CM Chen, RH Horng, YC Chiang, DS Wuu Microelectronics Reliability 52 (5), 861-865, 2012 | 82 | 2012 |
| Electromigration-induced Bi segregation in eutectic SnBi solder joint CM Chen, LT Chen, YS Lin Journal of electronic materials 36 (2), 168-172, 2007 | 76 | 2007 |
| Effects of silver doping on electromigration of eutectic SnBi solder C Chen, C Huang Journal of Alloys and Compounds 461 (1-2), 235-241, 2008 | 69 | 2008 |
| Optimized thermal management from a chip to a heat sink for high-power GaN-based light-emitting diodes RH Horng, JS Hong, YL Tsai, DS Wuu, CM Chen, CJ Chen IEEE Transactions on Electron Devices 57 (9), 2203-2207, 2010 | 63 | 2010 |
| The Al/Ni interfacial reactions under the influence of electric current WC Liu, SW Chen, CM Chen Journal of electronic materials 27 (1), L6-L9, 1998 | 62 | 1998 |
| Electromigration effect upon the Zn/Ni and Bi/Ni interfacial reactions CM Chen, SW Chen Journal of electronic materials 29 (10), 1222-1228, 2000 | 57 | 2000 |
| Electromigration effects upon interfacial reactions S Chen, C Chen JOM 55 (2), 62-67, 2003 | 55 | 2003 |
| Reactive wetting between molten Sn-Bi and Ni substrate JI Lee, SW Chen, HY Chang, CM Chen Journal of electronic materials 32 (3), 117-122, 2003 | 50 | 2003 |
| Microstructural evolution of the Au–20 wt.% Sn solder on the Cu substrate during reflow H Chung, C Chen, C Lin, C Chen Journal of Alloys and Compounds 485 (1-2), 219-224, 2009 | 49 | 2009 |
| Interfacial reactions between eutectic SnZn solder and bulk or thin-film Cu substrates C Chen, C Chen Journal of Electronic Materials 36 (10), 1363-1371, 2007 | 45 | 2007 |
| Effects of copper doping on microstructural evolution in eutectic SnBi solder stripes under annealing and current stressing CM Chen, CC Huang, CN Liao, KM Liou Journal of electronic materials 36 (7), 760-765, 2007 | 44 | 2007 |
| Electromigration effects upon the low-temperature Sn/Ni interfacial reactions C Chen, S Chen Journal of materials research 18 (6), 1293-1296, 2003 | 42 | 2003 |
| Interfacial reactions between Cu and SnAgCu solder doped with minor Ni HK Cheng, CW Huang, H Lee, YL Wang, TF Liu, CM Chen Journal of Alloys and Compounds 622, 529-534, 2015 | 41 | 2015 |
