Mohd Arif Anuar Mohd Salleh
TitleCited byYear
Rapid Cu6Sn5 growth at liquid Sn/solid Cu interfaces
MAAM Salleh, SD McDonald, H Yasuda, A Sugiyama, K Nogita
Scripta Materialia 100, 17-20, 2015
Effect of Ni on the Formation and Growth of Primary Cu6Sn5 Intermetallics in Sn-0.7 wt.%Cu Solder Pastes on Cu Substrates During the Soldering Process
MAAM Salleh, SD McDonald, CM Gourlay, SA Belyakov, H Yasuda, ...
Journal of Electronic Materials 45 (1), 154-163, 2016
Management of palm oil mill effluent through production of cellulases by filamentous fungi
SS Rashid, MZ Alam, MIA Karim, MH Salleh
World Journal of Microbiology and Biotechnology 25 (12), 2219-2226, 2009
Suppression of Cu6Sn5 in TiO2 reinforced solder joints after multiple reflow cycles
MAAM Salleh, SD McDonald, CM Gourlay, H Yasuda, K Nogita
Materials & Design 108, 418-428, 2016
MH Zan@ Hazizi, F
M Salleh, MA Abdullah
Somidin, NFM Alui, and Z. A. Ahmad: Materials Science and Engineering 556 …, 2012
Optimization of the nutrient supplements for cellulase production with the basal medium palm oil mill effluent
SS Rashid, MZ Alam, MIA Karim, MH Salleh
World Acad. Sci. Eng. Technol 60, 809-815, 2009
The influence of ageing on the stabilisation of interfacial (Cu, Ni) 6 (Sn, Zn) 5 and (Cu, Au, Ni) 6Sn5 intermetallics in Pb-free Ball Grid Array (BGA) solder joints
G Zeng, SD McDonald, D Mu, Y Terada, H Yasuda, Q Gu, MAAM Salleh, ...
Journal of Alloys and Compounds 685, 471-482, 2016
Effect of TiO2 additions on Sn-0.7 Cu-0.05 Ni lead-free composite solder
MII Ramli, N Saud, MAAM Salleh, MN Derman, RM Said
Microelectronics Reliability 65, 255-264, 2016
Development of a microwave sintered TiO2 reinforced Sn–0.7 wt% Cu–0.05 wt% Ni alloy
MAAM Salleh, SD McDonald, Y Terada, H Yasuda, K Nogita
Materials & Design 82, 136-147, 2015
Non-metal reinforced lead-free composite solder fabrication methods and its reinforcing effects to the suppression of intermetallic formation: short review
MAA Mohd Salleh, S McDonald, K Nogita
Applied Mechanics and Materials 421, 260-266, 2013
Zn-Sn based high temperature solder-A short review
SA Musa, M Salleh, MA Anuar, S Norainiza
Advanced Materials Research 795, 518-521, 2013
Mechanical properties of Sn–0.7 Cu/Si3N4 lead-free composite solder
MAAM Salleh, AMM Al Bakri, MH Zan, F Somidin, NFM Alui, ZA Ahmad
Materials Science and Engineering: A 556, 633-637, 2012
In situ imaging of microstructure formation in electronic interconnections
MAAM Salleh, CM Gourlay, JW Xian, SA Belyakov, H Yasuda, ...
Scientific reports 7, 40010, 2017
Total phenolic content and total flavonoid content in moringa oleifera seed
F Ghafar, T Nazrin, MMR Salleh, NN Hadi, N Ahmad, AA Hamzah, ...
Galeri Warisan Sains 1 (1), 23-25, 2017
Effects of Ni and TiO2 additions in as-reflowed and annealed Sn0. 7Cu solders on Cu substrates
MAAM Salleh, SD McDonald, K Nogita
Journal of Materials Processing Technology 242, 235-245, 2017
Intermetallic compound formation on solder alloy/Cu-substrate interface using lead-free Sn-0.7 Cu/recycled-Aluminum composite solder
F Somidin, M Salleh, MA Anuar, RA Khairel
Advanced Materials Research 620, 105-111, 2013
MH Zan@ Hazizi, and F
MAAM Salleh, AMM Al Bakri, H Kamarudin, M Bnhussain
Somidin, Phys. Procedia 22, 299, 2011
Strength of concrete based cement using recycle ceramic waste as aggregate
AM Al Bakri, MN Norazian, H Kamarudin, MAA Mohd Salleh, A Alida
Advanced Materials Research 740, 734-738, 2013
H Kamarudin, Bnhussain M, Zan@ Hazizi MH, Somidin F. Solderability of Sn-0.7 Cu/Si3N4 lead-free composite solder on Cu-substrate
MAA Mohd Salleh, AM Mustafa Al Bakri
Physics Procedia 22, 299-304, 2011
Wettability, electrical and mechanical properties of 99.3 Sn-0.7 Cu/Si3N4 novel lead-free nanocomposite solder
M Salleh, MA Anuar, MH Hazizi, ZA Ahmad, K Hussin, KR Ahmad
Advanced Materials Research 277, 106-111, 2011
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