Mohd Arif Anuar Mohd Salleh
Cited by
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Strength development of solely ground granulated blast furnace slag geopolymers
IH Aziz, MMAB Abdullah, MAAM Salleh, EA Azimi, J Chaiprapa, ...
Construction and Building Materials 250, 118720, 2020
Rapid Cu6Sn5 growth at liquid Sn/solid Cu interfaces
MAAM Salleh, SD McDonald, H Yasuda, A Sugiyama, K Nogita
Scripta Materialia 100, 17-20, 2015
Suppression of Cu6Sn5 in TiO2 reinforced solder joints after multiple reflow cycles
MAAM Salleh, SD McDonald, CM Gourlay, H Yasuda, K Nogita
Materials & Design 108, 418-428, 2016
Mechanical properties of Sn–0.7 Cu/Si3N4 lead-free composite solder
MAAM Salleh, AMM Al Bakri, MH Zan, F Somidin, NFM Alui, ZA Ahmad
Materials Science and Engineering: A 556, 633-637, 2012
Solderability of Sn-0.7 Cu/Si3N4 lead-free composite solder on Cu-substrate
MS MAA, AMM Al Bakri, H Kamarudin, M Bnhussain, F Somidin
Physics Procedia 22, 299-304, 2011
Effects of Ni and TiO2 additions in as-reflowed and annealed Sn0. 7Cu solders on Cu substrates
MAAM Salleh, SD McDonald, K Nogita
Journal of Materials Processing Technology 242, 235-245, 2017
Effect of TiO2 additions on Sn-0.7 Cu-0.05 Ni lead-free composite solder
MII Ramli, N Saud, MAAM Salleh, MN Derman, RM Said
Microelectronics Reliability 65, 255-264, 2016
Effect of Ni on the Formation and Growth of Primary Cu6Sn5 Intermetallics in Sn-0.7 wt.%Cu Solder Pastes on Cu Substrates During the Soldering Process
MAA Mohd Salleh, SD McDonald, CM Gourlay, SA Belyakov, H Yasuda, ...
Journal of Electronic Materials 45, 154-163, 2016
In situ imaging of microstructure formation in electronic interconnections
MAAM Salleh, CM Gourlay, JW Xian, SA Belyakov, H Yasuda, ...
Scientific reports 7 (1), 40010, 2017
The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7 Cu-0.05 Ni alloys for high strength soldering
MII Ramli, MAAM Salleh, H Yasuda, J Chaiprapa, K Nogita
Materials & Design 186, 108281, 2020
Strength of concrete based cement using recycle ceramic waste as aggregate
AMM Al Bakri, MN Norazian, H Kamarudin, MAA Mohd Salleh, A Alida
Advanced materials research 740, 734-738, 2013
Development of a microwave sintered TiO2 reinforced Sn–0.7 wt% Cu–0.05 wt% Ni alloy
MAAM Salleh, SD McDonald, Y Terada, H Yasuda, K Nogita
Materials & Design 82, 136-147, 2015
Bonding strength characteristics of FA-based geopolymer paste as a repair material when applied on opc substrate
WW Ahmad Zailani, A Bouaissi, MMAB Abdullah, R Abd Razak, S Yoriya, ...
Applied Sciences 10 (9), 3321, 2020
Strength development and elemental distribution of dolomite/fly ash geopolymer composite under elevated temperature
EA Azimi, MMAB Abdullah, P Vizureanu, MAAM Salleh, AV Sandu, ...
Materials 13 (4), 1015, 2020
Characterising the polymorphic phase transformation at a localised point on a Cu6Sn5 grain
F Somidin, H Maeno, MAAM Salleh, XQ Tran, SD McDonald, ...
Materials Characterization 138, 113-119, 2018
The influence of ageing on the stabilisation of interfacial (Cu, Ni) 6 (Sn, Zn) 5 and (Cu, Au, Ni) 6Sn5 intermetallics in Pb-free Ball Grid Array (BGA) solder joints
G Zeng, SD McDonald, D Mu, Y Terada, H Yasuda, Q Gu, MAAM Salleh, ...
Journal of Alloys and Compounds 685, 471-482, 2016
Influence of Ni on the refinement and twinning of primary Cu6Sn5 in Sn-0.7 Cu-0.05 Ni
JW Xian, MAAM Salleh, SA Belyakov, TC Su, G Zeng, K Nogita, H Yasuda, ...
Intermetallics 102, 34-45, 2018
Microstructure and porosity evolution of alkali activated slag at various heating temperatures
IH Aziz, MMAB Abdullah, MAAM Salleh, S Yoriya, J Chaiprapa, ...
Journal of Materials Research and Technology 9 (6), 15894-15907, 2020
Zn-Sn based high temperature solder-A short review
SA Musa, MAA Mohd Salleh, N Saud
Advanced Materials Research 795, 518-521, 2013
Non-metal reinforced lead-free composite solder fabrication methods and its reinforcing effects to the suppression of intermetallic formation: short review
MAA Mohd Salleh, K Nogita, S Mcdonald
Applied Mechanics and Materials 421, 260-266, 2013
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