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Mohd Arif Anuar Mohd Salleh
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Strength development of solely ground granulated blast furnace slag geopolymers
IH Aziz, MMAB Abdullah, MAAM Salleh, EA Azimi, J Chaiprapa, ...
Construction and Building Materials 250, 118720, 2020
1202020
Mechanical properties of Sn–0.7 Cu/Si3N4 lead-free composite solder
MAAM Salleh, AMM Al Bakri, MH Zan, F Somidin, NFM Alui, ZA Ahmad
Materials Science and Engineering: A 556, 633-637, 2012
852012
Rapid Cu6Sn5 growth at liquid Sn/solid Cu interfaces
MAAM Salleh, SD McDonald, H Yasuda, A Sugiyama, K Nogita
Scripta Materialia 100, 17-20, 2015
792015
Suppression of Cu6Sn5 in TiO2 reinforced solder joints after multiple reflow cycles
MAAM Salleh, SD McDonald, CM Gourlay, H Yasuda, K Nogita
Materials & Design 108, 418-428, 2016
732016
Effects of Ni and TiO2 additions in as-reflowed and annealed Sn0. 7Cu solders on Cu substrates
MAAM Salleh, SD McDonald, K Nogita
Journal of Materials Processing Technology 242, 235-245, 2017
712017
Solderability of Sn-0.7 Cu/Si3N4 lead-free composite solder on Cu-substrate
MS MAA, AMM Al Bakri, H Kamarudin, M Bnhussain, F Somidin
Physics Procedia 22, 299-304, 2011
69*2011
Effect of TiO2 additions on Sn-0.7 Cu-0.05 Ni lead-free composite solder
MII Ramli, N Saud, MAAM Salleh, MN Derman, RM Said
Microelectronics Reliability 65, 255-264, 2016
642016
Effect of Ni on the Formation and Growth of Primary Cu6Sn5 Intermetallics in Sn-0.7 wt.%Cu Solder Pastes on Cu Substrates During the Soldering Process
MAA Mohd Salleh, SD McDonald, CM Gourlay, SA Belyakov, H Yasuda, ...
Journal of Electronic Materials 45, 154-163, 2016
582016
In situ imaging of microstructure formation in electronic interconnections
MAAM Salleh, CM Gourlay, JW Xian, SA Belyakov, H Yasuda, ...
Scientific reports 7 (1), 40010, 2017
562017
The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7 Cu-0.05 Ni alloys for high strength soldering
MII Ramli, MAAM Salleh, H Yasuda, J Chaiprapa, K Nogita
Materials & Design 186, 108281, 2020
522020
Bonding strength characteristics of FA-based geopolymer paste as a repair material when applied on OPC substrate
WW Ahmad Zailani, A Bouaissi, MMAB Abdullah, R Abd Razak, S Yoriya, ...
Applied Sciences 10 (9), 3321, 2020
512020
Strength development and elemental distribution of dolomite/fly ash geopolymer composite under elevated temperature
EA Azimi, MMAB Abdullah, P Vizureanu, MAAM Salleh, AV Sandu, ...
Materials 13 (4), 1015, 2020
482020
Development of a microwave sintered TiO2 reinforced Sn–0.7 wt% Cu–0.05 wt% Ni alloy
MAAM Salleh, SD McDonald, Y Terada, H Yasuda, K Nogita
Materials & Design 82, 136-147, 2015
452015
Strength of concrete based cement using recycle ceramic waste as aggregate
AMM Al Bakri, MN Norazian, H Kamarudin, MAA Mohd Salleh, A Alida
Advanced materials research 740, 734-738, 2013
452013
Characterising the polymorphic phase transformation at a localised point on a Cu6Sn5 grain
F Somidin, H Maeno, MAAM Salleh, XQ Tran, SD McDonald, ...
Materials Characterization 138, 113-119, 2018
442018
The influence of ageing on the stabilisation of interfacial (Cu, Ni) 6 (Sn, Zn) 5 and (Cu, Au, Ni) 6Sn5 intermetallics in Pb-free Ball Grid Array (BGA) solder joints
G Zeng, SD McDonald, D Mu, Y Terada, H Yasuda, Q Gu, MAAM Salleh, ...
Journal of Alloys and Compounds 685, 471-482, 2016
422016
Diverse material based geopolymer towards heavy metals removal: A review
P Arokiasamy, MMAB Abdullah, SZ Abd Rahim, M Sadique, LY Ming, ...
journal of materials research and technology 22, 126-156, 2023
352023
The influence of sintering temperature on the pore structure of an alkali-activated kaolin-based geopolymer ceramic
MII Ramli, MAAM Salleh, MMAB Abdullah, IH Aziz, TC Ying, ...
Materials 15 (7), 2667, 2022
332022
Influence of Ni on the refinement and twinning of primary Cu6Sn5 in Sn-0.7 Cu-0.05 Ni
JW Xian, MAAM Salleh, SA Belyakov, TC Su, G Zeng, K Nogita, H Yasuda, ...
Intermetallics 102, 34-45, 2018
332018
Zn-Sn based high temperature solder-A short review
SA Musa, MAA Mohd Salleh, N Saud
Advanced Materials Research 795, 518-521, 2013
302013
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