| Void formation and its impact on CuSn intermetallic compound formation G Ross, V Vuorinen, M Paulasto-Kröckel Journal of Alloys and Compounds 677, 127-138, 2016 | 62 | 2016 |
| Stability and residual stresses of sputtered wurtzite AlScN thin films E Österlund, G Ross, MA Caro, M Paulasto-Kröckel, A Hollmann, M Klaus, ... Physical Review Materials 5 (3), 035001, 2021 | 27 | 2021 |
| Atomic layer deposition of AlN from AlCl3 using NH3 and Ar/NH3 plasma V Rontu, P Sippola, M Broas, G Ross, T Sajavaara, H Lipsanen, ... Journal of Vacuum Science & Technology A 36 (2), 2018 | 26 | 2018 |
| The impact of residual stress on resonating piezoelectric devices G Ross, H Dong, CB Karuthedath, AT Sebastian, T Pensala, ... Materials & Design 196, 109126, 2020 | 22 | 2020 |
| Characterization of AlScN-based multilayer systems for piezoelectric micromachined ultrasound transducer (pMUT) fabrication K Bespalova, E Österlund, G Ross, M Paulasto-Kröckel, AT Sebastian, ... Journal of Microelectromechanical Systems 30 (2), 290-298, 2021 | 17 | 2021 |
| The role of ultrafine crystalline behavior and trace impurities in copper on intermetallic void formation G Ross, P Malmberg, V Vuorinen, M Paulasto-Kröckel ACS Applied Electronic Materials 1 (1), 88-95, 2018 | 15 | 2018 |
| A humidity-induced novel failure mechanism in power semiconductor diodes J Leppänen, G Ross, V Vuorinen, J Ingman, J Jormanainen, ... Microelectronics Reliability 123, 114207, 2021 | 13 | 2021 |
| Wafer level solid liquid Interdiffusion bonding: formation and evolution of microstructures V Vuorinen, H Dong, G Ross, J Hotchkiss, J Kaaos, M Paulasto-Kröckel Journal of Electronic Materials 50, 818-824, 2021 | 13 | 2021 |
| Void formation in Cu-Sn SLID bonding for MEMS G Ross, H Xu, V Vuorinen, M Paulasto-Kröckel Proceedings of the 5th Electronics System-integration Technology Conference …, 2014 | 10 | 2014 |
| Achieving low-temperature wafer level bonding with Cu-Sn-In ternary at 150° C O Golim, V Vuorinen, G Ross, T Wernicke, M Pawlak, N Tiwary, ... Scripta Materialia 222, 114998, 2023 | 9 | 2023 |
| Interfacial void segregation of Cl in Cu-Sn micro-connects G Ross, X Tao, M Broas, N Mäntyoja, V Vuorinen, A Graff, F Altmann, ... Electronic Materials Letters 13, 307-312, 2017 | 9 | 2017 |
| Gigahertz scanning acoustic microscopy analysis of voids in Cu-Sn micro-connects G Ross, V Vuorinen, M Petzold, M Paulasto-Kröckel, S Brand Applied Physics Letters 110 (5), 2017 | 8 | 2017 |
| Co, In, and Co–In alloyed Cu6Sn5 interconnects: Microstructural and mechanical characteristics F Emadi, V Vuorinen, G Ross, M Paulasto-Kröckel Materials Science and Engineering: A 881, 145398, 2023 | 7 | 2023 |
| Impact of inherent design limitations for Cu–Sn SLID microbumps on its electromigration reliability for 3D ICs N Tiwary, G Ross, V Vuorinen, M Paulasto-Kröckel IEEE Transactions on Electron Devices 70 (1), 222-229, 2022 | 7 | 2022 |
| Metalorganic chemical vapor deposition of aluminum nitride on vertical surfaces E Österlund, S Suihkonen, G Ross, A Torkkeli, H Kuisma, ... Journal of Crystal Growth 531, 125345, 2020 | 7 | 2020 |
| Finite element simulation of solid–liquid interdiffusion bonding process: Understanding process-dependent thermomechanical stress N Tiwary, V Vuorinen, G Ross, M Paulasto-Kröckel IEEE Transactions on Components, Packaging and Manufacturing Technology 12 …, 2022 | 6 | 2022 |
| Investigation of the microstructural evolution and detachment of Co in contact with Cu–Sn electroplated silicon chips during solid-liquid interdiffusion bonding F Emadi, V Vuorinen, H Dong, G Ross, M Paulasto-Kröckel Journal of Alloys and Compounds 890, 161852, 2022 | 6 | 2022 |
| Aluminum Nitride to silicon direct bonding for an alternative Silicon-On-Insulator platform J Kaaos, G Ross, M Paulasto-Krockel ACS applied materials & interfaces 13 (32), 38857-38865, 2021 | 6 | 2021 |
| The effect of platinum contact metallization on Cu/Sn bonding A Rautiainen, G Ross, V Vuorinen, H Dong, M Paulasto-Kröckel Journal of Materials Science: Materials in Electronics 29, 15212-15222, 2018 | 6 | 2018 |
| Void formation in Cu-Sn micro-connects G Ross, V Vuorinen, M Paulasto-Kröckel 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2193-2199, 2015 | 6 | 2015 |
