Zheng Bo LAI
Title
Cited by
Cited by
Year
Molecular dynamics simulation of mechanical behavior of osteopontin-hydroxyapatite interfaces
ZB Lai, M Wang, C Yan, A Oloyede
Journal of the Mechanical Behavior of Biomedical Materials 36, 12-20, 2014
352014
Atomistic simulation of surface functionalization on the interfacial properties of graphene-polymer nanocomposites
MC Wang, ZB Lai, D Galpaya, C Yan, N Hu, LM Zhou
Journal of Applied Physics 115 (12), 123520, 2014
342014
Surface functionalization on the thermal conductivity of graphene–polymer nanocomposites
M Wang, D Galpaya, ZB Lai, Y Xu, C Yan
International Journal of Smart and Nano Materials 5 (2), 123-132, 2014
312014
Mechanical behaviour of staggered array of mineralised collagen fibrils in protein matrix: Effects of fibril dimensions and failure energy in protein matrix
ZB Lai, C Yan
Journal of the Mechanical Behavior of Biomedical Materials 65, 236-247, 2017
152017
Molecular dynamics simulation of fracture strength and morphology of defective graphene
MC Wang, C Yan, D Galpaya, ZB Lai, L Ma, N Hu, Q Yuan, RX Bai, ...
Journal of Nano Research 23, 43-49, 2013
122013
Effect of nano-scale constraint on the mechanical behaviour of osteopontin–hydroxyapatite interfaces
ZB Lai, R Bai, C Yan
Computational Materials Science 126, 59-65, 2017
72017
Fatigue of Sn-4Ag-0.5 Cu solder joints during cyclic bending of a BGA assembly
ZB Lai, WK Loh, MN Tamin
11th International Conference on Electronic Materials and Packaging (EMAP), 2009
72009
Interfacial mechanical behaviour of protein–mineral nanocomposites: A molecular dynamics investigation
ZB Lai, R Bai, Z Lei, C Yan
Journal of Biomechanics 73, 161-167, 2018
42018
Mechanics of Sn-4Ag-0.5 Cu solder joints in a ball grid array assembly during reflow and temperature cycles
ZB Lai, N Kamsah, WK Loh, MN Tamin
33rd International Electronics Manufacturing Technology Conference (IEMT), 2008
42008
Damage mechanics of solder/IMC interface fracture in Pb-free solder interconnects
ZB Lai, WK Loh, MN Tamin
11th Electronics Packaging Technology Conference (EPTC), 731-736, 2009
32009
Reliability modeling of microelectronics assembly – Constitutive model for lead-free solder joints
ZB Lai, N Kamsah, MN Tamin
6th Student Conference on Research and Development (SCOReD), 2008
32008
Classical and damage mechanics-based models for lead-free solder interconnects
ZB Lai
Universiti Teknologi Malaysia, Malaysia, 2009
22009
Thermal transport in graphene-polymer nanocomposites
M Wang, D Galpaya, ZB Lai, Y Xu, C Yan
4th International Conference on Smart Materials and Nanotechnology in …, 2013
12013
Numerical investigation of the role of osteopontin on the mechanical strength of biological composites
ZB Lai
Computer Methods in Biomechanics and Biomedical Engineering 22 (15), 1186-1196, 2019
2019
Molecular dynamics investigation on shearing between osteopontin and hydroxyapatite in biological materials
ZB Lai, C Yan, A Oloyede
Advanced Materials Research 891, 3-8, 2014
2014
Numerical investigation of deformation and failure mechanisms of osteopontin-hydroxyapatite interfaces and mineralized collagen fibril arrays
ZB Lai
Queensland University of Technology, 2014
2014
Cohesive zone modelling of mineralized collagen fibril arrays in bending
ZB Lai, A Oloyede, C Yan
4th International Conference on Computational Methods (ICCM), 2012
2012
Damage mechanics model for solder/intermetallics interface fracture process in solder joints
NM Shaffiar, ZB Lai, MN Tamin
Key Engineering Materials 462, 1409-1414, 2011
2011
Deformation and stresses in electronic package due to thermal cycling
ZB Lai, N Kamsah
Penerbit UTM, 2008
2008
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Articles 1–19