| Atomistic simulation of surface functionalization on the interfacial properties of graphene-polymer nanocomposites MC Wang, ZB Lai, D Galpaya, C Yan, N Hu, LM Zhou Journal of Applied Physics 115 (12), 123520, 2014 | 63 | 2014 |
| Molecular dynamics simulation of mechanical behavior of osteopontin-hydroxyapatite interfaces ZB Lai, M Wang, C Yan, A Oloyede Journal of the Mechanical Behavior of Biomedical Materials 36, 12-20, 2014 | 61 | 2014 |
| Surface functionalization on the thermal conductivity of graphene–polymer nanocomposites M Wang, D Galpaya, ZB Lai, Y Xu, C Yan International Journal of Smart and Nano Materials 5 (2), 123-132, 2014 | 57 | 2014 |
| Mechanical behaviour of staggered array of mineralised collagen fibrils in protein matrix: Effects of fibril dimensions and failure energy in protein matrix ZB Lai, C Yan Journal of the Mechanical Behavior of Biomedical Materials 65, 236-247, 2017 | 32 | 2017 |
| Molecular dynamics simulation of fracture strength and morphology of defective graphene MC Wang, C Yan, D Galpaya, ZB Lai, L Ma, N Hu, Q Yuan, RX Bai, ... Journal of Nano Research 23, 43-49, 2013 | 16 | 2013 |
| Interfacial mechanical behaviour of protein–mineral nanocomposites: A molecular dynamics investigation ZB Lai, R Bai, Z Lei, C Yan Journal of Biomechanics 73, 161-167, 2018 | 11 | 2018 |
| Effect of nano-scale constraint on the mechanical behaviour of osteopontin–hydroxyapatite interfaces ZB Lai, R Bai, C Yan Computational Materials Science 126, 59-65, 2017 | 11 | 2017 |
| Fatigue of Sn-4Ag-0.5 Cu solder joints during cyclic bending of a BGA assembly ZB Lai, WK Loh, MN Tamin 11th International Conference on Electronic Materials and Packaging (EMAP), 2009 | 7 | 2009 |
| Mechanics of Sn-4Ag-0.5 Cu solder joints in a ball grid array assembly during reflow and temperature cycles ZB Lai, N Kamsah, WK Loh, MN Tamin 33rd International Electronics Manufacturing Technology Conference (IEMT), 2008 | 7 | 2008 |
| Damage mechanics of solder/IMC interface fracture in Pb-free solder interconnects ZB Lai, WK Loh, MN Tamin 11th Electronics Packaging Technology Conference (EPTC), 731-736, 2009 | 5 | 2009 |
| Reliability modeling of microelectronics assembly – Constitutive model for lead-free solder joints ZB Lai, N Kamsah, MN Tamin 6th Student Conference on Research and Development (SCOReD), 2008 | 4 | 2008 |
| Thermal transport in graphene-polymer nanocomposites M Wang, D Galpaya, ZB Lai, Y Xu, C Yan 4th International Conference on Smart Materials and Nanotechnology in …, 2013 | 2 | 2013 |
| Damage mechanics model for solder/intermetallics interface fracture process in solder joints NM Shaffiar, ZB Lai, MN Tamin Key Engineering Materials 462, 1409-1414, 2011 | 2 | 2011 |
| Classical and damage mechanics-based models for lead-free solder interconnects ZB Lai Universiti Teknologi Malaysia, Malaysia, 2009 | 2 | 2009 |
| Numerical investigation of the role of osteopontin on the mechanical strength of biological composites ZB Lai Computer Methods in Biomechanics and Biomedical Engineering 22 (15), 1186-1196, 2019 | | 2019 |
| Molecular dynamics investigation on shearing between osteopontin and hydroxyapatite in biological materials ZB Lai, C Yan, A Oloyede Advanced Materials Research 891, 3-8, 2014 | | 2014 |
| Numerical investigation of deformation and failure mechanisms of osteopontin-hydroxyapatite interfaces and mineralized collagen fibril arrays ZB Lai Queensland University of Technology, 2014 | | 2014 |
| Cohesive zone modelling of mineralized collagen fibril arrays in bending ZB Lai, A Oloyede, C Yan 4th International Conference on Computational Methods (ICCM), 2012 | | 2012 |
| Deformation and stresses in electronic package due to thermal cycling ZB Lai, N Kamsah Penerbit UTM, 2008 | | 2008 |
