| Highly sensitive 4H-SiC pressure sensor at cryogenic and elevated temperatures TK Nguyen, HP Phan, T Dinh, KM Dowling, ARM Foisal, DG Senesky, ... Materials & Design 156, 441-445, 2018 | 64 | 2018 |
| Profile evolution of high aspect ratio silicon carbide trenches by inductive coupled plasma etching KM Dowling, EH Ransom, DG Senesky Journal of Microelectromechanical Systems 26 (1), 135-142, 2016 | 58 | 2016 |
| Highly sensitive pressure sensors employing 3C-SiC nanowires fabricated on a free standing structure HP Phan, KM Dowling, TK Nguyen, T Dinh, DG Senesky, T Namazu, ... Materials & Design 156, 16-21, 2018 | 49 | 2018 |
| InAlN/GaN high electron mobility micro-pressure sensors for high-temperature environments CA Chapin, RA Miller, KM Dowling, R Chen, DG Senesky Sensors and Actuators A: Physical 263, 216-223, 2017 | 39 | 2017 |
| Sensitivity of 2DEG-based Hall-effect sensors at high temperatures HS Alpert, CA Chapin, KM Dowling, SR Benbrook, H Köck, ... Review of Scientific Instruments 91 (2), 2020 | 35 | 2020 |
| Effect of geometry on sensitivity and offset of AlGaN/GaN and InAlN/GaN Hall-effect sensors HS Alpert, KM Dowling, CA Chapin, AS Yalamarthy, SR Benbrook, ... IEEE Sensors Journal 19 (10), 3640-3646, 2019 | 30 | 2019 |
| Significant phonon drag enables high power factor in the AlGaN/GaN two-dimensional electron gas AS Yalamarthy, M Muñoz Rojo, A Bruefach, D Boone, KM Dowling, ... Nano letters 19 (6), 3770-3776, 2019 | 21 | 2019 |
| Micro-tesla offset in thermally stable AlGaN/GaN 2DEG Hall plates using current spinning KM Dowling, HS Alpert, AS Yalamarthy, PF Satterthwaite, S Kumar, ... IEEE Sensors Letters 3 (3), 1-4, 2019 | 18 | 2019 |
| Low offset and noise in high biased GaN 2DEG Hall-effect plates investigated with infrared microscopy KM Dowling, T Liu, HS Alpert, CA Chapin, SR Eisner, AS Yalamarthy, ... Journal of Microelectromechanical Systems 29 (5), 669-676, 2020 | 13 | 2020 |
| Multilayer etch masks for 3-dimensional fabrication of robust silicon carbide microstructures KM Dowling, AJ Suria, A Shankar, CA Chapin, DG Senesky 2015 28th IEEE International Conference on Micro Electro Mechanical Systems …, 2015 | 13 | 2015 |
| Inductive coupled plasma etching of high aspect ratio silicon carbide microchannels for localized cooling KM Dowling, AJ Suria, Y Won, A Shankar, H Lee, M Asheghi, ... International Electronic Packaging Technical Conference and Exhibition 56901 …, 2015 | 12 | 2015 |
| Design and simulation of near-terahertz GaN photoconductive switches–operation in the negative differential mobility regime and pulse compression S Rakheja, K Li, KM Dowling, AM Conway, LF Voss IEEE Journal of the Electron Devices Society 9, 521-532, 2021 | 11 | 2021 |
| The effect of bias conditions on AlGaN/GaN 2DEG Hall plates KM Dowling, HS Alpert, P Zhang, AN Ramirez, A Yalamathy, H Kock, ... Solid State Sensors, Actuators, and Microsystems Workshop, 194-197, 2018 | 11 | 2018 |
| Pulse compression photoconductive switching using negative differential mobility K Dowling, Y Dong, D Hall, S Mukherjee, JD Schneider, S Hau-Riege, ... IEEE Transactions on Electron Devices 69 (2), 590-596, 2021 | 9 | 2021 |
| Monte Carlo transport analysis to assess intensity dependent response of a carbon-doped GaN photoconductor W Milestone, D Guo, M Sanati, KM Dowling, S Hau-Riege, LF Voss, ... Journal of Applied Physics 129 (19), 2021 | 9 | 2021 |
| Characterization of the piezoresistance in highly doped p-type 3C-SiC at cryogenic temperatures HP Phan, KM Dowling, TK Nguyen, CA Chapin, T Dinh, RA Miller, J Han, ... RSC advances 8 (52), 29976-29979, 2018 | 9 | 2018 |
| High-throughput pulsed laser manufacturing etch process for complex and released structures from bulk 4H-SiC EH Ransom, KM Dowling, D Rocca-Bejar, JW Palko, DG Senesky 2017 IEEE 30th International Conference on Micro Electro Mechanical Systems …, 2017 | 9 | 2017 |
| High sensitivity, high density micro-hydraulic force sensor array utilizing stereo-lithography fabrication technique MM Sadeghi, K Dowling, RL Peterson, K Najafi 2013 IEEE 26th International Conference on Micro Electro Mechanical Systems …, 2013 | 9 | 2013 |
| Overview of wide/ultra-wide bandgap power semiconductor devices for distributed energy resources SK Mazumder, LF Voss, K Dowling, A Conway, D Hall, RJ Kaplar, ... IEEE Journal of Emerging and Selected Topics in Power Electronics, 2023 | 7 | 2023 |
| Lithography and Etching‐Free Microfabrication of Silicon Carbide on Insulator Using Direct UV Laser Ablation TK Nguyen, HP Phan, KM Dowling, AS Yalamarthy, T Dinh, ... Advanced Engineering Materials 22 (4), 1901173, 2020 | 7 | 2020 |
Debbie G. Senesky, Ph.D.Associate Professor, Stanford UniversityVerified email at stanford.edu
