Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability K Zeng, R Stierman, TC Chiu, D Edwards, K Ano, KN Tu Journal of applied physics 97 (2), 2005 | 527 | 2005 |
Effect of thermal aging on board level drop reliability for Pb-free BGA packages TC Chiu, K Zeng, R Stierman, D Edwards, K Ano 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE …, 2004 | 365 | 2004 |
Stress-induced voiding under vias connected to wide Cu metal leads ET Ogawa, JW McPherson, JA Rosal, KJ Dickerson, TC Chiu, LY Tsung, ... 2002 IEEE International Reliability Physics Symposium. Proceedings. 40th …, 2002 | 210 | 2002 |
One-dimensional wave propagation in a functionally graded elastic medium TC Chiu, F Erdogan Journal of Sound and Vibration 222 (3), 453-487, 1999 | 146 | 1999 |
Polymer-embedded solder bumps for reliable plastic package attachment TC Chiu, MN Variyam US Patent 6,696,644, 2004 | 140 | 2004 |
Constitutive behavior of Sn3. 8Ag0. 7Cu and Sn1. 0Ag0. 5Cu alloys at creep and low strain rate regimes D Bhate, D Chan, G Subbarayan, TC Chiu, V Gupta, DR Edwards IEEE Transactions on Components and Packaging Technologies 31 (3), 622-633, 2008 | 126 | 2008 |
Interface reliability assessments for copper/low-k products CD Hartfield, ET Ogawa, YJ Park, TC Chiu, H Guo IEEE Transactions on Device and Materials Reliability 4 (2), 129-141, 2004 | 64 | 2004 |
Warpage simulation for the reconstituted wafer used in fan-out wafer level packaging TC Chiu, EY Yeh Microelectronics Reliability 80, 14-23, 2018 | 55 | 2018 |
Pre-doped reflow interconnections for copper pads K Zeng, TC Chiu, R Holdford US Patent App. 10/919,144, 2005 | 44 | 2005 |
Wire loop grid array package G Howard, H Test, TC Chiu US Patent App. 10/741,919, 2005 | 44 | 2005 |
Analysis of stress intensity factors for three-dimensional interface crack problems in electronic packages using the virtual crack closure technique TC Chiu, HC Lin International Journal of Fracture 156, 75-96, 2009 | 39 | 2009 |
Debonding of graded coatings under in-plane compression TC Chiu, F Erdogan International Journal of Solids and Structures 40 (25), 7155-7179, 2003 | 32 | 2003 |
Heat conduction in a functionally graded medium with an arbitrarily oriented crack TC Chiu, SW Tsai, CH Chue International Journal of Heat and Mass Transfer 67, 514-522, 2013 | 30 | 2013 |
Warpage evolution of overmolded ball grid array package during post-mold curing thermal process TC Chiu, HW Huang, YS Lai Microelectronics Reliability 51 (12), 2263-2273, 2011 | 27 | 2011 |
Raised solder-mask-defined (SMD) solder ball pads for a laminate electronic circuit board TC Chiu, MN Variyam US Patent 7,294,451, 2007 | 26 | 2007 |
Composite lid for land grid array (LGA) flip-chip package assembly TC Chiu US Patent 6,784,535, 2004 | 25 | 2004 |
Arrangement in semiconductor packages for inhibiting adhesion of lid to substrate while providing compression support TC Chiu, RC Dunne US Patent 7,126,217, 2006 | 24 | 2006 |
System and method for polymer encapsulated solder lid attach TC Chiu, C Odegard US Patent App. 11/140,767, 2006 | 22 | 2006 |
Flip-chip device strengthened by substrate metal ring TC Chiu, M Yunus US Patent 6,734,567, 2004 | 22 | 2004 |
Using DMA to simultaneously acquire Young's relaxation modulus and time-dependent Poisson's ratio of a viscoelastic material DL Chen, TC Chiu, TC Chen, MH Chung, PF Yang, YS Lai Procedia Engineering 79, 153-159, 2014 | 20 | 2014 |