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Alexander Schmidt
Alexander Schmidt
Principal Engineer, Samsung Innovation Center, CSE team
Verified email at samsung.com
Title
Cited by
Cited by
Year
Growth of three-dimensional SiC clusters on Si modelled by KMC
AA Schmidt, VS Kharlamov, KL Safonov, YV Trushin, EE Zhurkin, ...
Computational materials science 33 (1-3), 375-381, 2005
232005
Modelling the formation of nano-sized SiC on Si
KL Safonov, AA Schmidt, DV Kulikov, V Cimalla, J Pezoldt
Materials Science Forum 433, 591-594, 2003
162003
Linear alignment of SiC dots on silicon substrates
V Cimalla, AA Schmidt, T Stauden, K Zekentes, O Ambacher, J Pezoldt
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer …, 2004
142004
Self-organized SiC nanostructures on silicon
V Cimalla, AA Schmidt, C Foerster, K Zekentes, O Ambacher, J Pezoldt
Superlattices and Microstructures 36 (1-3), 345-351, 2004
142004
A new kinetic lattice Monte Carlo modeling framework for the source-drain selective epitaxial growth process
R Chen, W Choi, A Schmidt, KH Lee, Y Park
2013 International Conference on Simulation of Semiconductor Processes and …, 2013
122013
Lateral alignment of SiC dots on Si
V Cimalla, J Pezoldt, T Stauden, AA Schmidt, K Zekentes, O Ambacher
physica status solidi (c) 1 (2), 337-340, 2004
92004
Computer simulation of ferroelectric property changes in PLZT ceramics under neutron irradiation
DV Kulikov, YV Trushin, VS Kharlamov, R Bittner, K Humer, HW Weber, ...
Fourth International Workshop on Nondestructive Testing and Computer …, 2001
92001
Simulation of quality of SiC/Si interface during MBE deposition of C on Si
DV Kulikov, AA Schmidt, SA Korolev, FM Morales, T Stauden, YV Trushin, ...
Materialwissenschaft und Werkstofftechnik: Entwicklung, Fertigung, Prüfung …, 2006
72006
Carbon surface diffusion and SiC nanocluster self-ordering
J Pezoldt, YV Trushin, VS Kharlamov, AA Schmidt, V Cimalla, ...
Nuclear Instruments and Methods in Physics Research Section B: Beam …, 2006
52006
Semiconductor device having impurity region
Y Sasaki, BS Kim, TG Kim, Y Moriyama, SH Song, A Schmidt, A Yoo, ...
US Patent 9,911,809, 2018
42018
Multi-scale simulation of MBE-grown SiC/Si nanostructures
AA Schmidt, YV Trushin, KL Safonov, VS Kharlamov, DV Kulikov, ...
Materials science forum 527, 315-318, 2006
42006
Estimation of the displacement threshold energies in Si and GaAs by means of ion sputtering of structures with thin marker layers
VS Kharlamov, BJ Ber, YV Trushin, EE Zhurkin, AP Kovarski, AA Schmidt
Fourth International Workshop on Nondestructive Testing and Computer …, 2001
42001
Atomistic simulation flow for source-drain epitaxy and contact formation processes of advanced logic devices
SY Lee, R Chen, A Schmidt, I Jang, DS Kim, C Ahn, W Choi, KH Lee
2016 International Conference on Simulation of Semiconductor Processes and …, 2016
32016
Compact process model of temperature dependent amorphization induced by ion implantation
A Schmidt, I Jang, T Kim, KH Lee, YK Park, MH Yoo, CH Chung
2010 International Conference on Simulation of Semiconductor Processes and …, 2010
32010
SIMS profiling of GaAs/δ-AlAs/GaAs/… heterostructures using polyatomic ionized oxygen clusters
BY Ber, AP Kovarsky, DY Kazantsev, YV Trushin, EE Zhurkin, AA Schmidt, ...
Technical physics letters 30, 836-838, 2004
32004
Kinetic Monte Carlo simulation of SiC nucleation on Si (111)
AA Schmidt, KL Safonov, YV Trushin, V Cimalla, O Ambacher, J Pezoldt
physica status solidi (a) 201 (2), 333-337, 2004
32004
Progress in dislocation stress field model and its appications
U Kwon, JG Min, SY Lee, A Schmidt, DS Kim, Y Kayama, Y Nishizawa, ...
2019 International Conference on Simulation of Semiconductor Processes and …, 2019
22019
Efficient Monte Carlo simulation of ion implantation into 3D FinFET structure
H Kubotera, Y Kayama, S Nagura, Y Usami, A Schmidt, U Kwon, KH Lee, ...
2014 20th International Conference on Ion Implantation Technology (IIT), 1-4, 2014
22014
System and method of analyzing a crystal defect
SB Shim, IG Shin, SY Lee, A Schmidt, SW Yi
US Patent 10,727,025, 2020
12020
Multi-domain process modeling for advanced logic and memory devices: from equimpments to materials
I Jang, H Ko, A Schmidt, SJ Kim, M Cha, H Ahn, H Park, DS Kim, HK Kang
2018 IEEE International Electron Devices Meeting (IEDM), 33.4. 1-33.4. 4, 2018
12018
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