H-Spillover through the Catalyst Saturation: An Ab Initio Thermodynamics Study AK Singh, MA Ribas, BI Yakobson Acs Nano 3 (7), 1657-1662, 2009 | 153 | 2009 |
Patterning nanoroads and quantum dots on fluorinated graphene MA Ribas, AK Singh, PB Sorokin, BI Yakobson Nano Research 4 (1), 143-152, 2011 | 149 | 2011 |
The ultimate diamond slab: GraphAne versus graphEne E Muņoz, AK Singh, MA Ribas, ES Penev, BI Yakobson Diamond and Related Materials 19 (5), 368-373, 2010 | 110 | 2010 |
Nanotube nucleation versus carbon-catalyst adhesion–Probed by molecular dynamics simulations MA Ribas, F Ding, PB Balbuena, BI Yakobson The Journal of chemical physics 131 (22), 224501, 2009 | 81 | 2009 |
Carbon nanotube nucleation driven by catalyst morphology dynamics E Pigos, ES Penev, MA Ribas, R Sharma, BI Yakobson, AR Harutyunyan ACS nano 5 (12), 10096-10101, 2011 | 68 | 2011 |
Development of low-temperature drop shock resistant solder alloys for handheld devices M Ribas, S Chegudi, A Kumar, R Pandher, R Raut, S Mukherjee, S Sarkar, ... Electronics Packaging Technology Conference (EPTC 2013), 2013 IEEE 15th, 48-52, 2013 | 25 | 2013 |
Lead-free and antimony-free tin solder reliable at high temperatures P Choudhury, M de Avila Ribas, S Mukherjee, A Kumar, S Sarkar, ... US Patent App. 14/698,450, 2015 | 18* | 2015 |
Sintering powder S Ghosal, R Pandher, O Khaselev, R Bhatkal, R Raut, B Singh, M Ribas, ... US Patent 20150353804A1, 2013 | 14* | 2013 |
Development of Lead-Free Alloys with Ultra-High Thermo-Mechanical Reliability P Choudhury, M Ribas, R Pandher, A Kumar, S Mukherjee, S Sarkar, ... Proc. of SMTA International, Chicago, 2015 | 8 | 2015 |
Solder compositions M de Avila Ribas, D Lodge, R Pandher, B Singh, RM Bhatkal, R Raut, ... US Patent App. 14/236,480, 2012 | 8 | 2012 |
Mathematical model of over-micron and nano-scale powders accumulation in a coke fixed-bed filter M de AVILA RIBAS, H NOGAMI, R TAKAHASHI, J YAGI ISIJ international 45 (3), 303-311, 2005 | 8 | 2005 |
Thermal and mechanical reliability of low-temperature solder alloys for handheld devices M Ribas, S Chegudi, A Kumar, R Pandher, R Raut, S Mukherjee, S Sarkar, ... Electronics Packaging Technology Conference (EPTC), 2014 IEEE 16th, 366-371, 2014 | 6 | 2014 |
High impact toughness solder alloy R Pandher, B Singh, S Sarkar, S Chegudi, AKN Kumar, K Chattopadhyay, ... US Patent App. 14/236,432, 2012 | 6 | 2012 |
Low Temperature Alloy Development for Electronics Assembly–Part II M Ribas, S Chegudi, A Kumar, S Mukherjee, S Sarkar, R Pandher, R Raut, ... Proc. SMTA International, Fort Worth, TX, 2013 | 5 | 2013 |
Rosin-free thermosetting flux formulations MDA Ribas, R Raut, TC Cucu, ST Yong, S Sarkar, RH Katagiriyappa US Patent 20160318134A1, 2014 | 3 | 2014 |
High Impact Solder Toughness Alloy R Pandher, B Singh, S Sarkar, S Chegudi, AKN Kumar, K Chattopadhyay, ... US Patent 20170304955A1, 2017 | 2 | 2017 |
Lead-free and antimony-free tin solder reliable at high temperatures P Choudhury, M de Avila Ribas, S Mukherjee, A Kumar, S Sarkar, ... US Patent 20160023309A1, 2015 | 2 | 2015 |
High impact solder toughness alloy R Pandher, B Singh, S Sarkar, S Chegudi, AKN Kumar, K Chattopadhyay, ... US Patent App. 14/980,105, 2015 | 1 | 2015 |
Wafer level CSP with ultra-high thermal reliability lead-free alloys M Ribas, G Lim, RT Bumagat, A Kumar, D Kosuri, P Augustine, ... Electronics Packaging and Technology Conference (EPTC), 2015 IEEE 17th, 1-6, 2015 | 1 | 2015 |
Low Voiding, High Reliability Solder Paste for Automotive, LED and Other Demanding Applications W Bent, R Raut, M Liberatore, T Ong, M Ribas Young 15, 28, 2015 | 1 | 2015 |