| Coil design and measurements of automotive magnetic resonant wireless charging system for high-efficiency and low magnetic field leakage H Kim, C Song, DH Kim, DH Jung, IM Kim, YI Kim, J Kim, S Ahn, J Kim IEEE Transactions on Microwave Theory and Techniques 64 (2), 383-400, 2016 | 227 | 2016 |
| EMI reduction methods in wireless power transfer system for drone electrical charger using tightly coupled three-phase resonant magnetic field C Song, H Kim, Y Kim, D Kim, S Jeong, Y Cho, S Lee, S Ahn, J Kim IEEE Transactions on Industrial Electronics 65 (9), 6839-6849, 2018 | 120 | 2018 |
| Thin hybrid metamaterial slab with negative and zero permeability for high efficiency and low electromagnetic field in wireless power transfer systems Y Cho, S Lee, DH Kim, H Kim, C Song, S Kong, J Park, C Seo, J Kim IEEE Transactions on Electromagnetic Compatibility 60 (4), 1001-1009, 2017 | 115 | 2017 |
| MXene–Graphene Field-Effect Transistor Sensing of Influenza Virus and SARS-CoV-2 Y Li, Z Peng, NJ Holl, MR Hassan, JM Pappas, C Wei, OH Izadi, Y Wang, ... ACS Omega, 2021 | 111 | 2021 |
| Thin PCB-type metamaterials for improved efficiency and reduced EMF leakage in wireless power transfer systems Y Cho, JJ Kim, DH Kim, S Lee, H Kim, C Song, S Kong, H Kim, C Seo, ... IEEE Transactions on Microwave Theory and Techniques 64 (2), 353-364, 2016 | 84 | 2016 |
| Smartwatch Strap Wireless Power Transfer System With Flexible PCB Coil and Shielding Material S Jeong, DH Kim, J Song, H Kim, S Lee, C Song, J Lee, J Song, J Kim IEEE Transactions on Industrial Electronics 66 (5), 4054-4064, 2018 | 77 | 2018 |
| First demonstration of junctionless accumulation-mode bulk FinFETs with robust junction isolation TK Kim, DH Kim, YG Yoon, JM Moon, BW Hwang, DI Moon, GS Lee, ... IEEE Electron Device Letters 34 (12), 1479-1481, 2013 | 77 | 2013 |
| Origin of Device Performance Enhancement of Junctionless Accumulation-Mode (JAM) Bulk FinFETs With High-Gate Spacers JH Choi, TK Kim, JM Moon, YG Yoon, BW Hwang, DH Kim, SH Lee IEEE Electron Device Letters 35 (12), 1182-1184, 2014 | 48 | 2014 |
| Low Leakage Electromagnetic Field Level and High Efficiency Using a Novel Hybrid Loop-Array Design for Wireless High Power Transfer System S Lee, DH Kim, Y Cho, H Kim, C Song, S Jeong, J Song, G Park, S Hong, ... IEEE Transactions on Industrial Electronics 66 (6), 4356-4367, 2018 | 39 | 2018 |
| Modeling and analysis of TSV noise coupling effects on RF LC-VCO and shielding structures in 3D IC J Lim, J Cho, DH Jung, JJ Kim, S Choi, DH Kim, M Lee, J Kim IEEE Transactions on Electromagnetic Compatibility 60 (6), 1939-1947, 2018 | 16 | 2018 |
| Design of conductive shield for wireless power transfer system for electric vehicle considering automotive body H Kim, C Song, DH Kim, J Kim 2015 IEEE International Symposium on Electromagnetic Compatibility (EMC …, 2015 | 16 | 2015 |
| EMI reduction in wireless power transfer system using spread spectrum frequency dithering H Kim, J Kim, S Jeong, S Lee, Y Cho, DH Kim, J Kim 2016 IEEE Wireless Power Transfer Conference (WPTC), 1-3, 2016 | 15 | 2016 |
| Polynomial Model-Based Eye Diagram Estimation Methods for LFSR-Based Bit Streams in PRBS Test and Scrambling J Park, S Park, Y Kim, G Park, H Park, D Lho, K Cho, S Lee, DH Kim, ... IEEE Transactions on Electromagnetic Compatibility 61 (6), 1867-1875, 2019 | 14 | 2019 |
| Measurement, Simulation and Mathematical Estimation of Magnetic Field Shielding Effectiveness of Sputtered Shielding Materials using Spiral Coils K Song, S Kim, S Jeong, DH Kim, K Son, J Heo, K Han, Y Jung, H Kim, ... 2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and …, 2018 | 14 | 2018 |
| Modeling and analysis of return paths of common mode EMI noise currents from motor drive system in hybrid electric vehicle M Moon, H Kim, J Song, Y Kwack, DH Kim, B Kim, E Kim, J Kim 2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC), 82-85, 2015 | 12 | 2015 |
| Limitations of First-Order Surface Impedance Boundary Condition and Its Effect on 2D Simulations for PCB Transmission Lines Y Guo, DH Kim, J He, S Yong, Y Liu, X Ye, J Fan 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2020 | 11 | 2020 |
| Through-Silicon Via Capacitance–Voltage Hysteresis Modeling for 2.5-D and 3-D IC DH Kim, Y Kim, J Cho, B Bae, J Park, H Lee, J Lim, JJ Kim, S Piersanti, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (6 …, 2017 | 11 | 2017 |
| Selective harmonic elimination method of radiation noise from automotive wireless power transfer system using active rectifier H Kim, S Jeong, DH Kim, J Kim, YI Kim, IM Kim 2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging …, 2016 | 11 | 2016 |
| Algorithm for extracting parameters of the coupling capacitance hysteresis cycle for TSV transient modeling and robustness analysis S Piersanti, E Pellegrino, F De Paulis, A Orlandi, DH Jung, DH Kim, J Kim, ... IEEE Transactions on Electromagnetic Compatibility 59 (4), 1329-1338, 2016 | 10 | 2016 |
| Through silicon via time domain crosstalk modeling considering hysteretic coupling capacitance S Piersanti, F De Paulis, A Orlandi, DH Kim, J Cho, J Kim 2015 IEEE International Symposium on Electromagnetic Compatibility (EMC …, 2015 | 10 | 2015 |
