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- Stephen Z. D. ChengUniversity of Akron, South China University of Technology, Donghua University, RensselaerVerified email at uakron.edu
- Zhiwei LinUniversity of Akron, Columbia University, NIST, South China University of TechnologyVerified email at zips.uakron.edu
- Chih-Hao HsuLawrence Berkeley National Laboratory, University of AkronVerified email at zips.uakron.edu
- AJ BoydstonUniversity of WisconsinVerified email at wisc.edu
- Xue-Hui DongUniversity of Akron; MIT; South China University of TechnologyVerified email at scut.edu.cn
- Wen-Bin ZhangPeking University; California Institute of Technology; The University of AkronVerified email at pku.edu.cn
- Zachariah A. PageThe University of Texas at AustinVerified email at utexas.edu
- BO NIThe university of akronVerified email at zips.uakron.edu
- Chrys WesdemiotisThe University of AkronVerified email at uakron.edu
- Mingjun HuangSCUT; MIT; UAkronVerified email at scut.edu.cn
- Edwin L. ThomasTAMU or Rice or MIT or UMassachusetts or UMinnesota or Cornell UniversityVerified email at mit.edu
- Ding TianRensselaer Polytechnic InstituteVerified email at rpi.edu
- An-Chang ShiMcMaster UniversityVerified email at mcmaster.ca
- Zhao WangSoochow UniversityVerified email at suda.edu.cn
- Yiwen LiProfessor in Sichuan UniversityVerified email at scu.edu.cn
- Xueyan FengFudan University, Texas A&M University, Rice University, University of AkronVerified email at fudan.edu.cn