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- Xue FengTsinghua UniversityVerified email at tsinghua.edu.cn
- John A. RogersSimpson/Querrey Professor, Northwestern UniversityVerified email at northwestern.edu
- Yonggang HuangWalter P. Murphy Professor of M.E., C.E.E. and M.S.E., Northwestern UniversityVerified email at northwestern.edu
- Kyung-In JangDaegu Gyeongbuk Institute of Science and TechnologyVerified email at dgist.ac.kr
- Yeguang XueApple Inc.Verified email at apple.com
- Roozbeh GhaffariNorthwestern University, Center for Bio-Integrated ElectronicsVerified email at northwestern.edu
- Anthony BanksNorthwestern UniversityVerified email at northwestern.edu
- Yanan Yuan (原亚南)Wuhan UniversityVerified email at whu.edu.cn
- Chi Hwan LeeLeslie A. Geddes Professor at Purdue UniversityVerified email at purdue.edu
- Siddharth KrishnanResearch Scientist, Massachusetts Institute of Technology, Boston Children's HospitalVerified email at mit.edu
- Heling WangAssociate Professor, Laboratory of Flexible Electronics Technology, Tsinghua UniversityVerified email at tsinghua.edu.cn
- YuHao LiuUniversity of Illinois, Urbana ChampaignVerified email at illinois.edu
- Renxiao XuUniversity of California Berkeley, Northwestern UniversityVerified email at u.northwestern.edu
- Ying ChenInstitute of Flexible Electronics Technology of THU, ZhejiangVerified email at ifet-tsinghua.org
- TAISONG PAN (潘泰松)University of Electronic Science and Technology of ChinaVerified email at uestc.edu.cn
- Zhaoqian XieProfessor of Engineering Mechanics, Dalian University of TechnologyVerified email at dlut.edu.cn
- Yihui ZhangProfessor of Engineering Mechanics, Tsinghua UniversityVerified email at mail.tsinghua.edu.cn
- Kan LiHuazhong University of Science and TechnologyVerified email at hust.edu.cn
- Matt PharrAssociate Professor of Mechanical Engineering, Texas A&M UniversityVerified email at tamu.edu
- Heng YangInstitute of Advanced Structure Technology, Beijing Institute of TechnologyVerified email at bit.edu.cn