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Fahimeh Emadi
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Microstructural, optical, and electrical characteristics of Ni/C doped BST thin films
F Emadi, A Nemati, M Hinterstein, E Adabifiroozjaei
Ceramics International 45 (5), 5503-5510, 2019
142019
Ionic interdiffusion as interaction mechanism between Al and Si3N4
E Adabifiroozjaei, P Koshy, F Emadi, SS Mofarah, H Ma, E Rastkerdar, ...
Journal of the American Ceramic Society 102 (8), 4835-4847, 2019
62019
Microstructural and mechanical characterization of Cu/Sn SLID bonding utilizing Co as contact metallization layer
F Emadi, V Vuorinen, S Mertin, K Widell, M Paulasto-Kröckel
Journal of Alloys and Compounds 929, 167228, 2022
52022
Investigation of the microstructural evolution and detachment of Co in contact with Cu–Sn electroplated silicon chips during solid-liquid interdiffusion bonding
F Emadi, V Vuorinen, H Dong, G Ross, M Paulasto-Kröckel
Journal of Alloys and Compounds 890, 161852, 2022
52022
Thermoelectric characteristics of InAs nanowire networks directly grown on flexible plastic substrates
T Koskinen, V Khayrudinov, F Emadi, H Jiang, T Haggren, H Lipsanen, ...
ACS Applied Energy Materials 4 (12), 14727-14734, 2021
52021
Co, In, and Co–In alloyed Cu6Sn5 interconnects: Microstructural and mechanical characteristics
F Emadi, V Vuorinen, G Ross, M Paulasto-Kröckel
Materials Science and Engineering: A 881, 145398, 2023
32023
Low-temperature die attach for power components: Cu-Sn-In solid-liquid interdiffusion bonding
F Emadi, S Liu, A Klami, N Tiwary, V Vuorinen, M Paulasto-Kröckel
2022 14th International Conference on Advanced Semiconductor Devices and …, 2022
22022
Utilizing Co as a contact metallization for wafer-level Cu-Sn-In SLID bonding used in MEMS and MOEMS packaging
F Emadi, V Vuorinen, M Paulasto-Kröckel
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC …, 2022
12022
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