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Co-authors
- Dayong JinInstitute for Biomedical Materials and Devices, UTSVerified email at uts.edu.au
- Fan WangProfessor | School of Physics | Beihang UniversityVerified email at buaa.edu.cn
- Zhijun MaSouth China University of TechnologyVerified email at scut.edu.cn
- Gungun LinUniversity of Technology SydneyVerified email at uts.edu.au
- Geng LinHuawei TechnologiesVerified email at huawei.com
- Wei RENShaanxi Normal UniversityVerified email at snnu.edu.cn
- Jun LinChangchun institute of Applied chemistryVerified email at ciac.ac.cn
- Hong-Tao SunPrincipal Researcher, National Institute for Materials Science, JapanVerified email at nims.go.jp
- Bin ZhuCorning IncorporatedVerified email at corning.com
- E WuEast China Normal UniversityVerified email at phy.ecnu.edu.cn
- Artur BednarkiewiczInstitute of Low Temperature and Structure Research, Polish Academy of SciencesVerified email at intibs.pl
- Kezhi ZhengJilin UniversityVerified email at jlu.edu.cn
- Xiaogang LiuNational University of SingaporeVerified email at nus.edu.sg
- Peng XiPeking UniversityVerified email at pku.edu.cn
- Yujia LiuMacquarie universityVerified email at mq.edu.au
- Jiangbo(Tim) ZhaoUniversity of HullVerified email at hull.ac.uk
- Xianlin ZhengPhysics&Astronomy, Macquarie UniversityVerified email at mq.edu.au
- Xusan YangProfessor and Director of Medical and applied physics center (IOPLY), Institute of physics, CASVerified email at iphy.ac.cn
- Xavier VidalTecnaliaVerified email at tecnalia.com
- Hao HeUniversity of Technology SydneyVerified email at student.uts.edu.au